hdi流程pcbppt課件-展示頁
2025-05-14 12:45本頁面
【正文】 ﹕ 小包裝 ? 外 包裝 Mitac China Confidential Micro Via Design Rule ( HDI) Blind via Design rule and capability Buried via Design rule and capability Mitac China Confidential MINI PRINTER NOTE BOOK PCMCIA CARD PORTABLE TERM. PORT FAX PORT PHONE MOBILE PHONE CAMCORDER COMPACT VCR PORTABLE CD COMPUTER COMMUNICATION CONSUMPTION TECHNOLOGY DEMAND Thinner Layer More Layer Higher Density HDI PROCESS Thin Dielectric Coating FlexRigid Combination Buried amp。 Blind Via Technology Via On Pad Technology ELECTRONIC PRODUCT DEMAND FUNCTIONS More Function Better Quality Complex Union APPEARANCE Smaller Lighter Thinner Why we need HDI process Mitac China Confidential C a se I I IB A C . Dimension on Micro via(L1?L2) Item Description Preferred Dimension Capability Dimension A Micro Via Diameter 4~10 4 ~10 B Capture Pad A+10 A+8 (Cpk: ) C Target Pad A+12 A+ ( Cpk :) Unit： mil Mitac China Confidential D B F E C Outer layer(1+N+1) N Item Preferred Dimension B Buried PTH Inner Layer (N) land Diameter A + 10 C Buried PTH Outer Layer (N) land Diameter A + 8 D PTH Outer Layer (1+N+1) land Diameter A + 8 E PTH Outer Layer (N) land Diameter A + 10 F PTH Inner Layer (N) land Diameter A + 12 “A” = Drill diameter 。 Aspect Ratio The Maximum aspect ratio(D/A) of Micro Via is The Preferred aspe
教學(xué)課件相關(guān)推薦
鄂ICP備17016276號-1