hdi流程pcbppt課件-資料下載頁(yè)
2025-05-05 12:45本頁(yè)面
【正文】 mp。 LDP Mitac China Confidential 水平去膠渣 盲孔電鍍制程流程 水平黑影 盲孔電鍍 ? Dielectric thickness： ? Blind Via diameter： 4 mil ? A/R of blindvia： ? Throwingpower： 82% ? PS:A/R= Aspect Ratio Mitac China Confidential HDI技術(shù)發(fā)展趨勢(shì)與華通策略 市場(chǎng)需求 華通策略 ? 輕薄短小 ? 增加 LDP技術(shù) ? 新干膜 for線路制程 技術(shù)要求 ? 多次盲埋孔 ? 細(xì)線路、 BGA ? 高的工作溫度 ? 高功能、高頻 ? 無(wú)鉛產(chǎn)品 ? 無(wú)鹵素產(chǎn)品 ? 應(yīng)用高 Tg值基材及 RCC ? 浸金、浸銀 ? 應(yīng)用無(wú)鹵素基材及無(wú)鹵素 RCC材料（ Halogen Free） ? 環(huán)保 Mitac China Confidential PCB Metal Finish Type Advantages Disadvantages HASL Lower Cost Good Solderability amp。 Reliability Leadfree Concern Unsuitable for fine pitch Poor Surface Uniformity Preflux Good Planarity No discoloration on Cu Surface Good reliability Difficult for O/S testing Causing thermal degradation Immersion Gold Good Planarity Good solderability Luxury appearance Higher Cost Reliability concern for fine pitch mBGA Immersion Gold +Preflux Good Planarity Good reliability for find pitch mBGA Complicated Process for manufacturing Higher Cost S/M amp。 D/F leaching concern Immersion Silver Good Planarity Good solderabilityamp。 Reliability Luxury appearance Sensitive to S and Cl Vulnerable from scratch Inconvenient for handing Immersion Gold +Super solder Related simple for manufacturing Better solderabilityamp。 reliability especially for mBGA Leadfree Concern Cost vary with superficial measure of super solder
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