【文章內(nèi)容簡介】 。filmislaminatedonbothsidesofthepanel.Dryfilmexposure:Apositiveimageisusedtocreateanegative(reverse)imageoftheexternalcircuitryontothedryfilm,notethatthedarkareasoftheartworkcoverthepanelholes.ThefilmandtheartworkareexposedtoUVlightandtheexternalimagecreated.Dryfilmdeveloping:Theunexposedareasofthedryfilmaredissolvedsway.Thedryfilmcreateasa“channel”forcopperpatternplatingtotakeplace.14).CopperPlatingCopperiselectrodepositedontothecopperfoilThatisoutlinedbythedryfilm.CopperisplatedOnthesurfaceandintheholesofthepanel.ThePanelsaresuspendedinanacidcopperbathalongWithcopperanodeballs.CurrentfromaDCRectifierdrivescoppertobeconsumedfromtheAnodesanddepositedontheplatedsurfaces.OrganicpoundsarealsointroducedtothePlatingbathstocontroldepositionrates.15).Tinplating:Immediatelyaftercopperplating,aThinlayer(0003”)oftiniselectroplatedontheSurfaceofthecopper.TinwillactasanetchresistInafuturemanufacturingprocess.16).Wetprocesses:DryfilmstripremovestheplatingResistexposingthebasecopperunderneath.TheplatedCopperremains,protectedbythetinplatingetchresist.17).TheexposedcopperisremovedthroughanetchingProcess,whiletheplatedthinactsasaresistprotectingthePlatedcopperfromtheetchant.18).Tinstrip:ThetinplateetchresistisStrippedoffandtheexternalcircuitryisExposed.(NotethattheremainingCopperconsistsofthreelayers:BasecopperElectrolesscopperElectroplatedcopperSoldermask.SurfaceCleaningScreenPrintTackDryPISMPhotoimageableSoldermaskExposureDevelopThermalCureSolderableFinishes1)HASL:HotAirSolderLeveler2)CommonAlternativestoHASLsolderProtect(OSP–.EntekCu56)?Organicpassivationofcoppersurface?PolpularalternativetoHASL?Someissueswithfluxpatibility?Costeffective?Veryshortshelflife–500hours?LimitedthermalexcitationsNickel/ImmersionGold:?SelectiveNickel/Goldplatingprocess?45microinchesofsoftgoldontopofinchesofNi.?Goodsolderabilitywithexcellentplanarity?SomeissueswithsoldermaskpatibilityPalladium(鈀 )?Compatiblewithallsolderingprocess?Lowsoluabilityinsolder?Simplefabricationprocess(directplateontocopper)PlanaritySolderabilityCost FabComplexityAIwirebondingAuwirebondingHASL No Best 1 No NoOSP Yes Good 1 No NoElectroless Nickel / Immersion GoldYes Good 2 Yes YesElectroless Palladlum Yes Good 3 ? DifficultComparisonofmoremonalternativefinishes１、線路印刷ETCHING RESIST PRINTING 銅箔導(dǎo)體寬度Ｍｉｎ：０．１８㎜Min.LINEWIDTH： ㎜銅箔導(dǎo)體間距Ｍｉｎ：０．２㎜Min.LINESPACING： ㎜銅箔導(dǎo)體距板邊Ｍｉｎ：０．３㎜Min.EDGETOCONDUCTOR： ㎜銅箔導(dǎo)體距沖孔邊Ｍｉｎ：０．３㎜Min.CLEARANCETOHOLES： ㎜銅導(dǎo)體最大面積ＵＬ規(guī)定Ｍａｘ：２０㎜MAX. UNPIERCED AREA： 20㎜ 線路印刷尺寸精度： 177。０．１０㎜REGISTRATION PRECISION： 177。㎜ GROUND設(shè)計距線路THE DISTANCE OF　 GROUND WITH CONDUCTOR TraceGroundxSOLDERRESI銅箔厚度 THETHICKNESSOFCOPPERUV防焊油墨UVSOLDERRESISTIR防焊油墨IRSOLDERRESIST３５ μｍ Ｍｉｎ?。埃常啊?㎜ Ｍｉｎ?。埃常怠?㎜７０ μｍ Ｍｉｎ?。埃矗怠?㎜ Ｍｉｎ　０．４５　 ㎜某公司關(guān)于單面板的技術(shù)參數(shù)最小焊圈MIN.ANNULARRINGRHOLEPAD (沖床 )設(shè) 計 方 式DESIGN規(guī) 格SPECIFICATIONＭｉｎ?。埃常癌L (沖床 )NORMALDESIGN熱沖板︰Ｍｉｎ ０．４０㎜PAPERPHENOLIC︰ min㎜冷沖板︰Ｍｉｎ ０．３５㎜CEM CEM3︰ min㎜WITHNCDRILLINGHOLE正面銅 PAD︰ Ｍｉｎ?。埃玻癌L背面銅 PAD︰ Ｍｉｎ　０．３０㎜ LDA wLAw線路突出與線路缺口 ︰ L＜ 2A， W≦ 20%D、 W≦ ㎜VARIANCEOFTHESPACINGVARIANCEOFLINEWIDTHANDTHESPACING線路缺口 ︰ L＜ 2A， W≦ 20%A、 W≦ ㎜VARIANCE OF LINE WIDTH雙面線路印刷正背導(dǎo)準確度 Ｍａｘ：０．１３㎜（．００５ “）REGISTRATION BETWEEN BOTH SIDE： Max ㎜（ .005“ ）２、防焊印刷S/MA︰ S/M圈B︰ PADRSOLDERRESIST防焊圈大於 PAD之最小距離（㎜）CLEARANCETOCONDUCTOR（㎜）銅箔厚度THICKNESSOFCOPPERUV防焊UVSOLDERRESISTIR防焊IRSOLDERRESIST３５　 μｍ Ｍｉｎ ０．１５㎜ Ｍｉｎ?。埃玻癌L７０　 μｍ Ｍｉｎ　０．２５㎜ Ｍｉｎ?。埃常癌L防焊油墨印刷厚度Ｍｉｎ：１０ μｍTHICKNESS︰ Min10μｍ防焊印刷準確度： 177。０．１５㎜REGISTRATION： 177。㎜防焊隔線最小寬度Min.SOLDERRESISTLINEWIDTHBETW