焊線及焊線工藝介紹(編輯修改稿)
2025-05-27 04:44 本頁面
【文章內容簡介】 bond Base pad lead Ultra Sonic Vibration heat PRESSURE Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead RH Formation of a loop pad lead RD (Reverse Distance) Formation of a loop pad lead pad lead pad lead Calculated Wire Length WIRE CLAMP ?CLOSE? pad lead Calculated Wire Length pad lead SEARCH DELAY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead 2nd Search Height Search Speed 2 Search Tol 2 pad lead Search Speed 2 Search Tol 2 pad lead Search Speed 2 Search Tol 2 Formation of a second bond pad lead heat Formation of a second bond Contact pad lead heat pad lead heat Formation of a second bond Base pad lead pad lead pad lead pad lead Tail length pad lead pad lead pad lead Disconnection of the tail pad lead Disconnection of the tail pad lead Formation of a new free air ball Material ? Leadfram ? Capillary ? Gold Wire Leadfram (I) Leadfram ( II ) CAPILLARY (I) ? Capillary Manufacturer (SPT, GAISER, PECO, TOTO…) ? Capillary Data ( Tip , Hole , CD , FAamp。OR , IC ) CAPILLARY (II) CAPILLARY (III) TIP ..…… Pad Pitch Pad pitch x ~ TIP Hole ..…. .Wire Diameter Wire diameter + ~ = H CD………Pad size/open/1 st Ball CD + ~ = 1st Bond Ball size FA amp。 OR….Pad pitch(um) FA 100 0,4 ~90/100 4,8,11 90 11,15 IC type …… loop type Gold Wire ? Gold Wire Manufacturer (Nippon , SUMTOMO , TANAKA…. ) ? Gold Wire Data ( Wire Diameter , Type , ) SPEC ? Pad Open amp。 Bond Pad Pitch ? Ball Size ? Ball Thickness ? Loop height ? Wire Pull ? Ball short ? Crater Test BPOamp。BPP ? 單位 : um or Mil
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