【正文】 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 Spare Parts List 審核會議 C5 目的 檢討試產(chǎn)結(jié)果及生產(chǎn)作業(yè)與流程 , 並決定是否進(jìn)入量產(chǎn) . 檢核項目 試產(chǎn)階段之問題與對策研討 . SCHEDULE檢討 . 量產(chǎn)計劃及備料狀況研討 . 試產(chǎn)階段 YEILD RATE分析與改善對策 New C System Product Development Proposal Phase Planning Phase Ramp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C5 checklist ?Service Guide ?EMC Safety report ?PD P/R yield rate analysis rpt ?PCBA inspection instruction ?Product inspection instruction ?MTBF DEMO test report C5/NPI C5 Meeting C5 工作重點及檢核項目 階段 C5試產(chǎn)階段 ( Production Pilot Run Phase) 負(fù)責(zé)單位 生產(chǎn)部門 (Production) 物管部門 (Material Management) 工程部門 (Engineering) 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 (Ramp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。12kV 5 Pass Panel (ref) 177。15kV 5 Pass NonOperating User connector : 177。12kV Panel Ⅰ : 177。Y, 177。 Storage 2 72 Hours Pass ELP 20℃ , Dynamic 50 72 Hours Pass Vibration(NonOp) 5~500Hz, , , X/Y/Z 3 Pass Shock(NonOp) 180G, 2msec, Half Sine, 177。 bug list review ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/Utility/Diagnostic release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 bug list review C3/PM C3 Meeting C3 工作重點及檢核項目 階段 C3樣品試作階段 (Lab Pilot Run Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 設(shè)計驗證 * 依測試結(jié)果修改、變更設(shè)計 工作重點 * 樣品試作材料準(zhǔn)備 * 樣品試作 * 針對樣品進(jìn)行測試及驗證 * 搜集 Project成本資料 * 擬定 C3品質(zhì)量化目標(biāo) * 機構(gòu)設(shè)計問題檢討及除錯 (Debug)， 測試報告檢討 * 電路設(shè)計問題檢討及除錯 (Debug)， 測試報告檢討 * 軟體設(shè)計問題檢討除錯 (Debug)， 測試報告檢討 * 法務(wù) 稽核文件之形成要件是否符合法定要件或工程規(guī)範(fàn) 專利著作權(quán)、商標(biāo)等智慧財產(chǎn)權(quán)之申請準(zhǔn)備 審核會議 C3 目的 檢討樣品測試驗證之結(jié)果、並決定是否進(jìn)入工程試作階段 檢核項目 * HW design verification report * Micro processor/EEPROM data listing * Mechanical test report * SW function verification test report * Mechanical Drawing (Preliminary) * C3 Test Report * C4 Test Plan New C System Product Development Proposal Phase Planning Phase Ramp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。D Design Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 軟、硬體、機構(gòu)設(shè)計 * 証實設(shè)計可行性 * 修正軟、硬體、機構(gòu)規(guī)格 工作重點 * 電路設(shè)計並完成電路圖 * 機構(gòu)設(shè)計並完成機構(gòu)設(shè)計圖 * 機電整合設(shè)計並完成機電介面設(shè)計 * 軟體設(shè)計並完成初步版本 * 電路設(shè)計 Review * 機構(gòu)設(shè)計 Review * 機電整合設(shè)計 Review * 建立初步之測試計畫 (硬體、軟體、機構(gòu) ) 審核會議 C2 目的 * 確定計畫規(guī)格 * 檢討設(shè)計階段之工作成效 * 決定是否進(jìn)入樣品試作 * 查核是否發(fā)出專利之申請 檢核項目 Schematics (Preliminary) S/W Specification Mechanical amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * *