【正文】 12kV 5 Pass Panel (ref) 177。 15kV 5 Pass NonOperating User connector : 177。 12kV Panel Ⅰ : 177。 Y, 177。 塑膠 ,線材 ,塗料 1000 PPM Cadmium (Cd) 鎘 100 PPM Mercury (Hg) 汞 1000 PPM Hex. Chromium (Cr6+) 六價鉻 1000 PPM PBB (聚溴聯(lián)苯 ) 1000 PPM PBDE (聚溴二苯醚 ) 1000 PPM ?重金屬： 汞、鉛、鎘、六價鉻 ?溴性耐燃劑：聚溴聯(lián)苯 (PBBs)、 溴聯(lián)苯醚 (PBDEs) 註：另有 管制規(guī)範外 的項目 EU WEEE Directive ? Directive 2023/96/EC期程 – 指令發(fā)布 – 歐盟公報發(fā)行，指令生效 – 轉(zhuǎn)為會員國當?shù)胤?,法規(guī)或行政指令 – 完成回收系統(tǒng)建構(gòu) ,製造商因應回收之 財務規(guī)劃就緒 – 回收再利用率達每人每年 4kg – 訂定下階段目標 ? 回收 Target of Recovery and Recycling (Waste Electrical and Electronic Equipment) WEEE Category Large household appliances Small household appliances IT telemunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys, leisure sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2023 New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點及檢核項目 階段 C2設計階段 (RD Design Phase) 負責單位 技術經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 軟、硬體、機構(gòu)設計 * 証實設計可行性 * 修正軟、硬體、機構(gòu)規(guī)格 工作重點 * 電路設計並完成電路圖 * 機構(gòu)設計並完成機構(gòu)設計圖 * 機電整合設計並完成機電介面設計 * 軟體設計並完成初步版本 * 電路設計 Review * 機構(gòu)設計 Review * 機電整合設計 Review * 建立初步之測試計畫 (硬體、軟體、機構(gòu) ) 審核會議 C2 目的 * 確定計畫規(guī)格 * 檢討設計階段之工作成效 * 決定是否進入樣品試作 * 查核是否發(fā)出專利之申請 檢核項目 Schematics (Preliminary) S/W Specification Mechanical Thermal Test Plan Invention Disclosure Invention Disclosure New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C3 checklist ?HW DV test report ?SW FV test report ?ME test report ?Reliability test report (prel.) ?ME/Artwork packing drawing ?PAL/ROM data listing ?C3 manufacturability review report ?Sample approve status bug list review C3/PM C3 Meeting C3 工作重點及檢核項目 階段 C3樣品試作階段 (Lab Pilot Run Phase) 負責單位 技術經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 設計驗證 * 依測試結(jié)果修改、變更設計 工作重點 * 樣品試作材料準備 * 樣品試作 * 針對樣品進行測試及驗證 * 搜集 Project成本資料 * 擬定 C3品質(zhì)量化目標 * 機構(gòu)設計問題檢討及除錯 (Debug)， 測試報告檢討 * 電路設計問題檢討及除錯 (Debug)， 測試報告檢討 * 軟體設計問題檢討除錯 (Debug)， 測試報告檢討 * 法務 稽核文件之形成要件是否符合法定要件或工程規(guī)範