【正文】 12kV 5 Pass Panel (ref) 177。 15kV 5 Pass NonOperating User connector : 177。 12kV Panel Ⅰ : 177。 Y, 177。 塑膠 ,線材 ,塗料 1000 PPM Cadmium (Cd) 鎘 100 PPM Mercury (Hg) 汞 1000 PPM Hex. Chromium (Cr6+) 六價(jià)鉻 1000 PPM PBB (聚溴聯(lián)苯 ) 1000 PPM PBDE (聚溴二苯醚 ) 1000 PPM ?重金屬： 汞、鉛、鎘、六價(jià)鉻 ?溴性耐燃劑：聚溴聯(lián)苯 (PBBs)、 溴聯(lián)苯醚 (PBDEs) 註：另有 管制規(guī)範(fàn)外 的項(xiàng)目 EU WEEE Directive ? Directive 2023/96/EC期程 – 指令發(fā)布 – 歐盟公報(bào)發(fā)行，指令生效 – 轉(zhuǎn)為會(huì)員國當(dāng)?shù)胤?,法規(guī)或行政指令 – 完成回收系統(tǒng)建構(gòu) ,製造商因應(yīng)回收之 財(cái)務(wù)規(guī)劃就緒 – 回收再利用率達(dá)每人每年 4kg – 訂定下階段目標(biāo) ? 回收 Target of Recovery and Recycling (Waste Electrical and Electronic Equipment) WEEE Category Large household appliances Small household appliances IT telemunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys, leisure sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2023 New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點(diǎn)及檢核項(xiàng)目 階段 C2設(shè)計(jì)階段 (RD Design Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 軟、硬體、機(jī)構(gòu)設(shè)計(jì) * 証實(shí)設(shè)計(jì)可行性 * 修正軟、硬體、機(jī)構(gòu)規(guī)格 工作重點(diǎn) * 電路設(shè)計(jì)並完成電路圖 * 機(jī)構(gòu)設(shè)計(jì)並完成機(jī)構(gòu)設(shè)計(jì)圖 * 機(jī)電整合設(shè)計(jì)並完成機(jī)電介面設(shè)計(jì) * 軟體設(shè)計(jì)並完成初步版本 * 電路設(shè)計(jì) Review * 機(jī)構(gòu)設(shè)計(jì) Review * 機(jī)電整合設(shè)計(jì) Review * 建立初步之測試計(jì)畫 (硬體、軟體、機(jī)構(gòu) ) 審核會(huì)議 C2 目的 * 確定計(jì)畫規(guī)格 * 檢討設(shè)計(jì)階段之工作成效 * 決定是否進(jìn)入樣品試作 * 查核是否發(fā)出專利之申請(qǐng) 檢核項(xiàng)目 Schematics (Preliminary) S/W Specification Mechanical Thermal Test Plan Invention Disclosure Invention Disclosure New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C3 checklist ?HW DV test report ?SW FV test report ?ME test report ?Reliability test report (prel.) ?ME/Artwork packing drawing ?PAL/ROM data listing ?C3 manufacturability review report ?Sample approve status bug list review C3/PM C3 Meeting C3 工作重點(diǎn)及檢核項(xiàng)目 階段 C3樣品試作階段 (Lab Pilot Run Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 設(shè)計(jì)驗(yàn)證 * 依測試結(jié)果修改、變更設(shè)計(jì) 工作重點(diǎn) * 樣品試作材料準(zhǔn)備 * 樣品試作 * 針對(duì)樣品進(jìn)行測試及驗(yàn)證 * 搜集 Project成本資料 * 擬定 C3品質(zhì)量化目標(biāo) * 機(jī)構(gòu)設(shè)計(jì)問題檢討及除錯(cuò) (Debug)， 測試報(bào)告檢討 * 電路設(shè)計(jì)問題檢討及除錯(cuò) (Debug)， 測試報(bào)告檢討 * 軟體設(shè)計(jì)問題檢討除錯(cuò) (Debug)， 測試報(bào)告檢討 * 法務(wù) 稽核文件之形成要件是否符合法定要件或工程規(guī)範(fàn)