【正文】 e bugs/issues information in the bug tracking system. ID/ME (Industrial Design/ Mechanical Engineering) * ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug tracking system used. Wistron Case Role amp。 tools, assembly tools, and SOP ready before C5 Exit. PD is responsible to produce the product. PD is not just for efficiency only but also quality. PSE (Process Engineer) PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP). FAE (Failure Analysis Engineer) or RE FAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable. TE TE is responsible for providing and maintaining Test Plan and Test Program. TE also implement all the preload to production line and report the problems related to preload to preload team. PMC/GPMC (Plan Material Control/ Global Plan Material Control) GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites. Wistron Case Wistron CSystem Quality Control Proposal Phase Planning Phase Ramp。 Report Format Definition Escalation Rule Measurement Standard Project Management amp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C1 checklist ?Invention disclosure ?Time schedule ?Project team ?Model number define ?Green design guide and review check list ?Non QVL/Sample approval request form C1/PM C1 Meeting C1工作重點及檢核項目 階段 C1規(guī)劃階段 (Planning Phase) 負責單位 計畫經理 (Project Manager) 或產品經理 (Product Manager) 目的 * 規(guī)格的擬訂 * 專案組織的成立 * 專案時程的規(guī)劃 工作重點 * 選任技術經理 (Technical Manager, 簡稱 TM) 並成立專案組織 * 計畫專案經理 (Project Manager)或產品經理，規(guī)劃專案時程 * 召開 C1審核會議 * 法務確認 Legal Concern、 如 Potential Patent List, Invention Disclosure * 成立專案團隊 審核會議 C1 目的 成立專案團隊、確定開發(fā)時程 檢核項目 Time Schedule Project Team Invention Disclosure Green Design Check List Sample Request Form Case bottle Coca in England 開採鋁礦 一噸鋁土提鍊半噸氧化鋁 半小時加工 半噸氧化鋁熔煉成 1/4噸金屬鋁 再加工二週成鋁錠 瑞典或梛威 熔爐工廠 澳大利亞 澳大利亞 化學還原工廠 加熱至華氏 900度 壓延成 1/8 inch薄片 瑞典和德國 壓延廠 船運一個月 冷軋成 1/80 inch薄片 冷軋廠 英國易開罐廠 成型，清洗，烘乾，防鏽 裝填，印刷 英國可樂廠 消費 鋁罐回收儘 16% Ecological Rucksack (生態(tài)包袱 ) – 生產一片半導體晶片所產生之廢料為產品重量之 十萬倍 – 生產一臺筆記型電腦所產生之廢料為產品重量之 四千倍 – 生產一公升佛羅里達橘子汁需要 兩公升汽油及一千公升之水 – 生產一噸紙需用掉 九十八噸 之其他資源 資料來源 : 綠色資本主義 ─ 天下出版社 EU RoHS Directive ? 指令期程 – 指令發(fā)布 – 歐盟公報發(fā)行 ,指令生效 – 轉為會員國當地法律 ,法規(guī)或行政指令 – 新投入之產品不得含有禁用物質 ? 指令要求 /禁用項目 – 鉛 (Pb) – 鎘 (Cd) – 汞 (Hg) – 六價鉻 (Cr6+) – 多溴聯苯 (PBB) – 多溴化二苯乙醚 (PBDE) (The restriction of the use of certain hazardous substances in electrical and electronic equipment) EU RoHS 管制規(guī)格 Substances . 建議值 Lead (Pb) 鉛 。D Design Phase) 負責單位 技術經理 (Technical Manager) 研發(fā)部門 目的 * 軟、硬體、機構設計 * 証實設計可行性 * 修正軟、硬體、機構規(guī)格 工作重點 * 電路設計並完成電路圖 * 機構設計並完成機構設計圖 * 機電整合設計並完成機電介面設計 * 軟體設計並完成初步版本 * 電路設計 Review * 機構設計 Review * 機電整合設計 Review * 建立初步之測試計畫 (硬體、軟體、機構 ) 審核會議 C2 目的 * 確定計畫規(guī)格 * 檢討設計階段之工作成效 * 決定是否進入樣品試作 * 查核是否發(fā)出專利之申請 檢核項目 Schematics (Preliminary) S/W Specification Mechanical amp。 Storage 2 72 Hours Pass ELP 20℃ , Dynamic 50 72 Hours Pass Vibration(NonOp) 5~500Hz, , , X/Y/Z 3 Pass Shock(NonOp) 180G, 2msec, Half Sine, 177。12kV 5 Pass Panel (ref) 177。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。Y, 177。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report