【正文】 e bugs/issues information in the bug tracking system. ID/ME (Industrial Design/ Mechanical Engineering) * ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug tracking system used. Wistron Case Role amp。 tools, assembly tools, and SOP ready before C5 Exit. PD is responsible to produce the product. PD is not just for efficiency only but also quality. PSE (Process Engineer) PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP). FAE (Failure Analysis Engineer) or RE FAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable. TE TE is responsible for providing and maintaining Test Plan and Test Program. TE also implement all the preload to production line and report the problems related to preload to preload team. PMC/GPMC (Plan Material Control/ Global Plan Material Control) GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites. Wistron Case Wistron CSystem Quality Control Proposal Phase Planning Phase Ramp。 Report Format Definition Escalation Rule Measurement Standard Project Management amp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C1 checklist ?Invention disclosure ?Time schedule ?Project team ?Model number define ?Green design guide and review check list ?Non QVL/Sample approval request form C1/PM C1 Meeting C1工作重點(diǎn)及檢核項(xiàng)目 階段 C1規(guī)劃階段 (Planning Phase) 負(fù)責(zé)單位 計(jì)畫(huà)經(jīng)理 (Project Manager) 或產(chǎn)品經(jīng)理 (Product Manager) 目的 * 規(guī)格的擬訂 * 專(zhuān)案組織的成立 * 專(zhuān)案時(shí)程的規(guī)劃 工作重點(diǎn) * 選任技術(shù)經(jīng)理 (Technical Manager, 簡(jiǎn)稱 TM) 並成立專(zhuān)案組織 * 計(jì)畫(huà)專(zhuān)案經(jīng)理 (Project Manager)或產(chǎn)品經(jīng)理，規(guī)劃專(zhuān)案時(shí)程 * 召開(kāi) C1審核會(huì)議 * 法務(wù)確認(rèn) Legal Concern、 如 Potential Patent List, Invention Disclosure * 成立專(zhuān)案團(tuán)隊(duì) 審核會(huì)議 C1 目的 成立專(zhuān)案團(tuán)隊(duì)、確定開(kāi)發(fā)時(shí)程 檢核項(xiàng)目 Time Schedule Project Team Invention Disclosure Green Design Check List Sample Request Form Case bottle Coca in England 開(kāi)採(cǎi)鋁礦 一噸鋁土提鍊半噸氧化鋁 半小時(shí)加工 半噸氧化鋁熔煉成 1/4噸金屬鋁 再加工二週成鋁錠 瑞典或梛威 熔爐工廠 澳大利亞 澳大利亞 化學(xué)還原工廠 加熱至華氏 900度 壓延成 1/8 inch薄片 瑞典和德國(guó) 壓延廠 船運(yùn)一個(gè)月 冷軋成 1/80 inch薄片 冷軋廠 英國(guó)易開(kāi)罐廠 成型，清洗，烘乾，防鏽 裝填，印刷 英國(guó)可樂(lè)廠 消費(fèi) 鋁罐回收儘 16% Ecological Rucksack (生態(tài)包袱 ) – 生產(chǎn)一片半導(dǎo)體晶片所產(chǎn)生之廢料為產(chǎn)品重量之 十萬(wàn)倍 – 生產(chǎn)一臺(tái)筆記型電腦所產(chǎn)生之廢料為產(chǎn)品重量之 四千倍 – 生產(chǎn)一公升佛羅里達(dá)橘子汁需要 兩公升汽油及一千公升之水 – 生產(chǎn)一噸紙需用掉 九十八噸 之其他資源 資料來(lái)源 : 綠色資本主義 ─ 天下出版社 EU RoHS Directive ? 指令期程 – 指令發(fā)布 – 歐盟公報(bào)發(fā)行 ,指令生效 – 轉(zhuǎn)為會(huì)員國(guó)當(dāng)?shù)胤?,法規(guī)或行政指令 – 新投入之產(chǎn)品不得含有禁用物質(zhì) ? 指令要求 /禁用項(xiàng)目 – 鉛 (Pb) – 鎘 (Cd) – 汞 (Hg) – 六價(jià)鉻 (Cr6+) – 多溴聯(lián)苯 (PBB) – 多溴化二苯乙醚 (PBDE) (The restriction of the use of certain hazardous substances in electrical and electronic equipment) EU RoHS 管制規(guī)格 Substances . 建議值 Lead (Pb) 鉛 。D Design Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門(mén) 目的 * 軟、硬體、機(jī)構(gòu)設(shè)計(jì) * 証實(shí)設(shè)計(jì)可行性 * 修正軟、硬體、機(jī)構(gòu)規(guī)格 工作重點(diǎn) * 電路設(shè)計(jì)並完成電路圖 * 機(jī)構(gòu)設(shè)計(jì)並完成機(jī)構(gòu)設(shè)計(jì)圖 * 機(jī)電整合設(shè)計(jì)並完成機(jī)電介面設(shè)計(jì) * 軟體設(shè)計(jì)並完成初步版本 * 電路設(shè)計(jì) Review * 機(jī)構(gòu)設(shè)計(jì) Review * 機(jī)電整合設(shè)計(jì) Review * 建立初步之測(cè)試計(jì)畫(huà) (硬體、軟體、機(jī)構(gòu) ) 審核會(huì)議 C2 目的 * 確定計(jì)畫(huà)規(guī)格 * 檢討設(shè)計(jì)階段之工作成效 * 決定是否進(jìn)入樣品試作 * 查核是否發(fā)出專(zhuān)利之申請(qǐng) 檢核項(xiàng)目 Schematics (Preliminary) S/W Specification Mechanical amp。 Storage 2 72 Hours Pass ELP 20℃ , Dynamic 50 72 Hours Pass Vibration(NonOp) 5~500Hz, , , X/Y/Z 3 Pass Shock(NonOp) 180G, 2msec, Half Sine, 177。12kV 5 Pass Panel (ref) 177。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。Y, 177。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report