【正文】 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C5 checklist ?Service Guide ?EMC Safety report ?PD P/R yield rate analysis rpt ?PCBA inspection instruction ?Product inspection instruction ?MTBF DEMO test report C5/NPI C5 Meeting C5 工作重點(diǎn)及檢核項(xiàng)目 階段 C5試產(chǎn)階段 ( Production Pilot Run Phase) 負(fù)責(zé)單位 生產(chǎn)部門 (Production) 物管部門 (Material Management) 工程部門 (Engineering) 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 (Ramp。12kV Panel Ⅰ : 177。 bug list review C3/PM C3 Meeting C3 工作重點(diǎn)及檢核項(xiàng)目 階段 C3樣品試作階段 (Lab Pilot Run Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 設(shè)計(jì)驗(yàn)證 * 依測(cè)試結(jié)果修改、變更設(shè)計(jì) 工作重點(diǎn) * 樣品試作材料準(zhǔn)備 * 樣品試作 * 針對(duì)樣品進(jìn)行測(cè)試及驗(yàn)證 * 搜集 Project成本資料 * 擬定 C3品質(zhì)量化目標(biāo) * 機(jī)構(gòu)設(shè)計(jì)問(wèn)題檢討及除錯(cuò) (Debug)， 測(cè)試報(bào)告檢討 * 電路設(shè)計(jì)問(wèn)題檢討及除錯(cuò) (Debug)， 測(cè)試報(bào)告檢討 * 軟體設(shè)計(jì)問(wèn)題檢討除錯(cuò) (Debug)， 測(cè)試報(bào)告檢討 * 法務(wù) 稽核文件之形成要件是否符合法定要件或工程規(guī)範(fàn) 專利著作權(quán)、商標(biāo)等智慧財(cái)產(chǎn)權(quán)之申請(qǐng)準(zhǔn)備 審核會(huì)議 C3 目的 檢討樣品測(cè)試驗(yàn)證之結(jié)果、並決定是否進(jìn)入工程試作階段 檢核項(xiàng)目 * HW design verification report * Micro processor/EEPROM data listing * Mechanical test report * SW function verification test report * Mechanical Drawing (Preliminary) * C3 Test Report * C4 Test Plan New C System Product Development Proposal Phase Planning Phase Ramp。 sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2022 New C System Product Development Proposal Phase Planning Phase Ramp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C0 Checklist ?MRS C0/PM C0 Meeting 階段 C0構(gòu)想階段 (Proposal Phase) 負(fù)責(zé)單位 計(jì)畫經(jīng)理 (Project Manager) 或產(chǎn)品經(jīng)理 (Product Manager) 目的 * 確訂提案構(gòu)想或市場(chǎng)需求規(guī)格書 (MRS) * 可行性分析 工作重點(diǎn) * 相關(guān)提案之市場(chǎng)資料搜集 * 相關(guān)提案之關(guān)鍵技術(shù)資料搜集 * Ramp。 SPC MTBF Demo CIP/CLCA Pareto Analysis EWG Ready AFR Test Reports PreQVL Ready Diagnostics Program Bug List amp。 Mentor library的建立與管理 . 信號(hào)品質(zhì) CAE分析 , PCB layout外包廠商之管理， PCB製造廠商之管理 . OS Certification 執(zhí)行公司各產(chǎn)品之 OS 相容性認(rèn)證測(cè)試及 LOGO 申請(qǐng) . . Beta Site 測(cè)試 PDM 料號(hào)編碼及控管 ,BOM製作 Wistron Case Role amp。D Ramp。 Responsibility (Ramp。D 人員負(fù)責(zé)產(chǎn)品之開(kāi)發(fā)、設(shè)計(jì)、測(cè)試規(guī)劃，包括 H/W、 S/W及 ID的開(kāi)發(fā)、設(shè)計(jì)、提出新發(fā)明及著作權(quán)揭露書 . Wistron Case Role amp。 Responsibility Function Responsibility PD (Production) PD has to work with PE, PME and IE respectively to get testing equipment amp。 Sourcing Integration Validation Release Product Life Cycle MDRR/C4 Go/ No Go? MRR/C5 Go/ No Go? C6 OOB/OBA ORT/Stress EWG/FQH AFR/DOA New C System Architecture Progress C0 Exit C0 Activity C0 Entry C1 Exit C1 Activity C1 Entry C2 Exit C2 Activity C2 Entry C3 Exit C3 Activity C3 Entry C4 Exit C4 Activity C4 Entry C5 Exit C5 Activity C5 Entry C6 Exit C6 Activity C6 Entry Time Detail Activities ?Subject ?Scope ?Definition ?Procedure ?…. Activities Definition Record amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list