【正文】 ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點(diǎn)及檢核項(xiàng)目 階段 C2設(shè)計(jì)階段 (Ramp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list C4/PM C4 Meeting Wistron Mobile Reliability Test Plan Environment ? Thermal Profile Test ? Temperature and Humidity Test ? Vibration, Shock, Drop Tests ? Altitude Test, Acoustics Tests ? MTBF Prediction EMC ? Lightning/Surge Test ? Voltage Dip Test ? EFT, ESD Test ? Harmonic Test ? IEC10004XX ? EMI/EMS Power Line Interference ? Line Voltage/Frequency Test ? Power Surge Test ? Voltage Dip and Interruption ? Power On/Off Test ? EFT/B Immunity Test ? Complex Margin Test Transportation ? Vibration Test ? Altitude Test ? Shock Test ? Drop Test User ? Incline Operation Test ? Bench Handling Test ? Power Saving Test ? Pressure Test ? Audio Quality ? Torture Test Reliability Test – LCD Module Wistron Mobile Reliability Test Plan Item Test Condition Sample Size Time Result High Temp / High Humid Op 50℃ 80%RH Dynamin 20 500 Hours Pass Low Temp Op 0℃ , Dynamic 5 500 Hours Pass High Temp Op 60℃ , Dynamic 10 500 Hours Pass High Temp / High Humid storage 60℃ , 90%RH, Storage 2 240 Hours Pass Low Temp storage 20℃ , Storage 2 240 Hours Pass T/C ( NonOp ) 20℃ (30Min) ~ 60℃ (30Min), Storage 3 100cycle Pass Altitude test Operating amp。2kV Bottom cover :177。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。Z 3 Pass Box Vibration 5~500Hz, , Box Drop 76㎝ drop 15 Pass ESD Operating Top_Case : 177。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C3 checklist ?HW DV test report ?SW FV test report ?ME test report ?Reliability test report (prel.) ?ME/Artwork packing drawing ?PAL/ROM data listing ?C3 manufacturability review report ?Sample approve status amp。 telemunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys, leisure amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 PreLoad WIH/WPH/WZS/WKS MRS Check Service Cost Estimate Simulation Design Peer Review Lessons Learned Availability Develop Plan Launch FAI amp。D轄下所屬之測(cè)試單位人員 ,主要負(fù)責(zé)各項(xiàng)產(chǎn)品之測(cè)試 ,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC., CE/Reliability 組件承認(rèn)測(cè)試 、 不良品故障分析及其他附件等材料品質(zhì)之管制及保證 產(chǎn)品相關(guān)之可靠度與環(huán)境實(shí)驗(yàn) ， 以及可靠度工程之研究與制定 . PCB PCB Layout之申請(qǐng)、 PCB之設(shè)計(jì)、 Orcad library amp。D RELEASE 開發(fā)階段 BOM CHANGE NOTICE. Ramp。R) ? Process – Cx Stage: ? C0: Proposal phase 構(gòu)想階段 ? C1: Planning phase 規(guī)劃階段 ? C2: Ramp。 Responsibility Function Responsibility HW (Hardware Design) * Hardware is responsible for Electronic Engineering Design * Coworks with S/W and QT to make sure that the every function works well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. SW (Software Design) * Software is responsible for the design of BIOS, Driver, Utilities, and S/W Preload. * S/W coworks with H/W and QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain th