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mount Technology for PC Board Design, Indianapolis: Howard W. Sams amp。 Company, 1989, p. 26796. 4. Ray P. Prasad, Surface Mount Technology Principles and Practices, New York: Van Nostrand Reinhold, 1989, p. 23565. 5. Sammy G. Shina, Concurrent Engineering and Design for Manufacture of Electronic Products, New York: Van Nostrand Reinhold, 1991. 6. David G. Ullman, The Mechanical Design Process, New York: McGrawHill Inc., 1993, p. 315, 25291. 有關(guān)的工業(yè)標(biāo)準(zhǔn)文件有許多工業(yè)文件可用於幫助DFM的實(shí)施。下面是一覽子設(shè)計(jì)有關(guān)的文件,有關(guān)這些或其他文件的情況,或要購買文件,請聯(lián)繫:IPC – Association Connecting Electronics Industries, (846) 5099700.Surface Mount Equipment Manufacturers Association (SMEMA), (847) 8311002.Electronic Industries Alliance (EIA), (703) 9077500.SMCWP004Design For ExcellenceIPCT50Terms and Definitions for Interconnecting and Packaging Electronic CircuitsIPCD275Design Standard for Rigid Printed Boards and Rigid Printed Board AssembliesIPCD279Design Guidelines for Reliable Surface Mount Technology Printed Board AssembliesIPCD322Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel SizesIPCD325Documentation Requirements for Printed Boards, Assemblies, and Support DrawingsIPCD330Design Guide ManualIPCD390Automated Design GuidelinesIPCC406Design and Application Guidelines for Surface Mount ConnectorsIPCSM782Surface Mount Design and Land Pattern StandardIPCEM782Surface Mount Design and Land Pattern Standard SpreadsheetEIAJEP95JEDEC Registered and Standard Outlines for Semiconductor DevicesSMEMA Fiducial Design StandardTracy Tyler is an Engineering and technical consultant。 (716) 3528362。 Email: ttyler@.Aaron Ho(08/15/2000)