【文章內(nèi)容簡(jiǎn)介】 金手指Immersion Silver 沉銀Immersion Golden 沉金Silver hole Plugging 銀漿灌孔Conductive Paste(Carbon Paste) 碳油Hole Plugging Material 塞孔OSP（Entek） 有機(jī)抗氧化劑Black（Brown）oxide treatment 黑化/棕化Hot air solder level 噴錫/熱風(fēng)整平Flux 松香Laminate boards 壓合第2項(xiàng)：溫度100176。C和MOT兩者中取其的最高溫度作為基準(zhǔn)溫度，超過(guò)該基準(zhǔn)溫度的工序制程必需在UL文件里授權(quán)第3項(xiàng)：制程外發(fā)加工必須授權(quán)總原則：如果一個(gè)工廠沒(méi)有UL文件授權(quán)分包方，則所有制程都必須在本生產(chǎn)地完成,而不能隨意將工序外發(fā)加工。第一種：Subcontractor:工序分包方；一般描述在UL文件總述Sec. Gen. P1里，并會(huì)注明相應(yīng)的生產(chǎn)地，并在PROCESS里面描述具體的分包工序；第二種：MultipleSite Processing多個(gè)加工地：一般描述在UL文件附頁(yè)App. D的Page 7里，并會(huì)具體說(shuō)明Process里哪些 Process Step會(huì)被放在多個(gè)加工地點(diǎn)進(jìn)行生產(chǎn)。 制程外發(fā)加工記錄要求： 針對(duì)工序分包方和多個(gè)加工地，如果流程描述中有任何生產(chǎn)步驟在另外的生產(chǎn)地址或分包地址進(jìn)行，那么原始生產(chǎn)商應(yīng)該提供文件給原始生產(chǎn)商，多個(gè)加工地或工序分包方應(yīng)在包裝上應(yīng)標(biāo)明，或提供一個(gè)特殊的卡片標(biāo)識(shí)如下內(nèi)容:(1)線路板的數(shù)量， (2)原始生產(chǎn)商的UL文件號(hào)(3)UL認(rèn)可的產(chǎn)品型號(hào)， (4)外發(fā)的流程步驟和的名字這些文件應(yīng)該隨完成工序后的線路板回到原始生產(chǎn)商手上。第4項(xiàng)：在線路板的整個(gè)生產(chǎn)過(guò)程中，有三個(gè)控制因素是必須特別關(guān)注的：溫度，時(shí)間，壓力。(1)必須要UL文件授權(quán)溫度的工序有：裁板后烘烤（這個(gè)是很多工廠最容被VN的工序）壓合溫度；綠油后烘烤；文字油后烘烤；噴錫溫度；其他吹干或烘烤溫度。(2) 時(shí)間：與時(shí)間有關(guān)的是溫度和壓合，所以我們還要針對(duì)每一個(gè)Process制程里的每一個(gè)時(shí)間限制進(jìn)行確認(rèn)！(3) 壓合：壓合制程除了溫度，時(shí)間外，壓強(qiáng)也是必須滿(mǎn)足UL要求。 壓強(qiáng)計(jì)算公式 （Formula）: S*P=S1*P1 S: area of cylinder P : pressure of meter S1: area of PWB P1: pressure on the PWB溫馨提示：壓強(qiáng)單位換算關(guān)系：第5項(xiàng)：儀器校準(zhǔn)要求(1)校準(zhǔn)基本要求：必須能追溯到國(guó)家或國(guó)際標(biāo)準(zhǔn)，并最好去通過(guò) ISO/IEC17025實(shí)驗(yàn)室認(rèn)證的實(shí)驗(yàn)室校準(zhǔn)；中國(guó)合格評(píng)定國(guó)家認(rèn)可委員會(huì)（英文縮寫(xiě)為：CNAS）是根據(jù)《中華人民共和國(guó)認(rèn)證認(rèn)可條例》的規(guī)定，由國(guó)家認(rèn)證認(rèn)可監(jiān)督管理委員會(huì)批準(zhǔn)設(shè)立并授權(quán)的國(guó)家認(rèn)可機(jī)構(gòu)，統(tǒng)一負(fù)責(zé)對(duì)認(rèn)證機(jī)構(gòu)、實(shí)驗(yàn)室和檢查機(jī)構(gòu)等相關(guān)機(jī)構(gòu)的認(rèn)可工作。 網(wǎng)址：(2)工廠也可以選擇內(nèi)校，但要求很多,必須具備相應(yīng)的校準(zhǔn)條件：標(biāo)準(zhǔn)件必須三年校準(zhǔn)一次，精度必須是待校器具的35倍及實(shí)驗(yàn)室必須具備相應(yīng)的測(cè)試治工具；測(cè)試報(bào)告的格式與外校報(bào)告基本要求一樣。校準(zhǔn)頻次Frequency of calibration,除非特別規(guī)定，一年一次。溫馨推薦：CCIC儀器校準(zhǔn) 優(yōu)爾國(guó)際推薦去CCIC儀器校準(zhǔn)中心,因?yàn)橹挥蠧CIC儀器校準(zhǔn)中心才懂UL標(biāo)準(zhǔn)，也只有他們才能按照UL的相關(guān)要求去校準(zhǔn)。UL抽樣總原則：原則一：如果基材沒(méi)有ANSI等級(jí)，則每年一次；原則二：如果基材有ANSI等級(jí)，則主要考慮以下三要素：ANSI等級(jí)、最大操作溫度(MOT)、浸錫溫度/時(shí)間(Solder Limits),這三要素任意的組合，就需要每年抽一次樣。Qusestion :僅阻燃認(rèn)證的線路板（UL 94 Flamlity Only）需要檢驗(yàn)員跟蹤檢驗(yàn)?zāi)甓瘸闃訂?？ANSWER:Qusestion :分包方（Subcontractor）需不需檢驗(yàn)員跟蹤檢驗(yàn)?zāi)甓瘸闃樱緼NSWER:抽樣數(shù)量判斷原則： (1) 如果至少有一條直導(dǎo)體的長(zhǎng)度≧（11/2 inch）,則只抽2pcs相同的樣品就可以； (2)如果至少有一條直導(dǎo)體的長(zhǎng)度≧(189。 inch),而＜（11/2 inch）,則需抽12pcs相同的樣品 (3) 如果沒(méi)有一條直導(dǎo)體長(zhǎng)度≧，則可以不用抽樣。UL796標(biāo)準(zhǔn)第20至30條款內(nèi)容PERFORMANCE 性能要求20 Test Samples試樣A plete set of samples shall be provided as scheduled in Table Table Sample for initial investigationReferences參考條款A(yù)Basic set of samples(See Figure ) represent all of production（提供有代表性的樣品） shall be of minimum thickness(基材最小厚度) conductor shall include minimum width(中間導(dǎo)體的最小寬度) conductor shall be of minimum width(邊緣導(dǎo)體的最小寬度) shall be at highest temperature and time limits using the selected etchant(蝕刻過(guò)程的最高溫度及時(shí)間限制) contain representative plating(提供典型的電鍍) contain plated contact fingers and/or throughholes if applicable電鍍鎳 / 金手指或線路圖形BExtra set of samples(added to A)附加樣品 each different base manufacturer提供基材的每一個(gè)供應(yīng)商 each different grade of family of base material劃分不同等級(jí)的基材 each basematerial cladding process提供每一基材的層壓制程 each copper weight range提供銅的重量范圍 a change in any process where the temperature on the surface of the board exceeds 100℃ or the maximum operating temperature of the printedwiring board, whichever is greater提供印刷線路板最大工作溫度CSets of 20 samples for flammability testsSee the Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances,UL94提供20個(gè)樣品做阻燃性測(cè)試，參照UL94標(biāo)準(zhǔn)22 Thermal Shock熱沖擊 The thermal shock test is designed to evaluate the physical fatigue of test samples exposed to the anticipated board assembly soldering temperatures. There shall be no wrinkling, cracking, blistering, or loosening of any conductor or any delamination of the laminate and/or prepreg materials as a result of the thermal shock testing熱沖擊試驗(yàn)為了評(píng)估PCB板過(guò)錫焊時(shí)的抗疲勞強(qiáng)度。熱沖擊試驗(yàn)后，不能出現(xiàn)起皺、破裂、起水泡、銅導(dǎo)線不能松開(kāi)、分層等現(xiàn)象。 All samples are to be conditioned at 121℃177。2℃ for hours prior to being subjected to the thermal shock described in and unless other time or temperature limits are specified by the manufacturer.在做熱沖擊試驗(yàn)前，樣品放在121℃177。2℃（除非制造商另有規(guī)定的溫度外） To determine pliance with ,all of the samples for the Bond Strength tests(section 23), delamination and Blistering tests(section 24),and Flammability test(section 22A) shall be subjected to a soldering or equivalent operation at the maximum temperature/dwelltime limits specified by the fabricator. Thermal shock shall be conducted immediately after the preconditioning in using one of the following apparatus:，由以下試驗(yàn)考核(所有的操作都不能超過(guò)制造商規(guī)定的溫度范圍),1. Bond Strength test 粘合強(qiáng)度試驗(yàn)2. Delamination and Blistering tests分層和起水泡試驗(yàn)3. Flammability test阻燃試驗(yàn)Apparatus:1. Convection OvenAttention shall be directed to maintaining the test temperature,when introducing and removing the samples into and from the oven chamber.對(duì)流烤箱：注意維持試驗(yàn)溫度，當(dāng)把樣品放進(jìn)或取出烘箱。2. Sand BathAttention shall be directed to the uniformity of temperature throughout the fluidized bed,and avoid mechanical damage imposed by an inadequately fluidized sand shall be prepared to prevent adhesion of shall not be tested for flammability if sand adheres to the sample.沙層：保證流動(dòng)層溫度的一致性，避免不適當(dāng)?shù)牧鲃?dòng)沙層造成的機(jī)械損傷。如果有沙粘在樣品上，則不能用來(lái)做阻燃試驗(yàn)。3. Solder PotAttention shall be directed to the samples when removing them from the solder pot so the solder does not join with the conductor shall be prepared so as not to have solder resist or excess solder on conductor traces.熔錫爐：把樣品過(guò)錫爐時(shí)，焊料不能粘接在印刷導(dǎo)線上，樣品要準(zhǔn)備好，避免印刷導(dǎo)線出現(xiàn)綠油及避免多余的焊料粘在印刷導(dǎo)線上。4. IR Reflow oven Attention shall be directed to the uniformity of temperature across the sample, due to the susceptibility of the materials used to fabricate test samples to infrared absorption.紅外線回流爐：Exception:samples shall be subjected to thermal shock immediately after preconditioning,or samples shall be immediately stored in a dessicator until thermal shock can be conducted經(jīng)過(guò)預(yù)處理的樣品應(yīng)立即進(jìn)行thermal shock試驗(yàn)，或?qū)悠反鎯?chǔ)在干燥器內(nèi)。 When a solde