中文--離散的瞬態(tài)傳熱熱源在水中垂直矩形通道冷卻-閱讀頁
2025-06-06 17:32本頁面
【正文】 Transfer, 4, pp. 384–390. 17 Kang, B. H., Jaluria, Y., and Tewari, S., 1990, “Mixed Convection Transport from an Isolated Heat Source Module on Horizontal Plate,” J. Heat Transfer, 112, pp. 653–661. 18 Tou, K. W., Xu, G. P., and Tso, C. P., 1998, “Direct Liquid Cooling of Elec tronic Chips by Singlephase Forced Convection on FC72,” Exp. Heat Trans fer, 11, pp. 121–134. 19 Bhowmik, H., Tso, C. P., and Tou, K. W., 2020, “Thermal Behavior of Simu lated Chips During Poweroff Transient Period,” 5th Electronic Packaging Technology Conference, Singapore, pp. 497–500. 20 Tso, C. P., Tou, K. W., and Bhowmik, H., 2020, “Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power,” J. Electron. Packag., 126 4 , pp. 546–553. 21 Tso, C. P., Xu, G. P., and Tou, K. W., 1999, “An Experimental Study on Forced Convection Heat Transfer from Flushmounted Discrete Heat Sources,” J. Heat Transfer, 121, pp. 326–332. 22 Perry, J. H., 1963, Chemical Engineer’s Handbook, 4th Ed. McGrawHill, New York. 23 Willingham, T. C., and Mudawar, I., 1970, “Forced Convection Boiling and Critical Heat Flux from a Linear Array of Discrete Heat Sources,” Int. J. Heat Mass Transfer, 35, pp. 2879–2890. 24 Heindel, T. J., Ramadhyani, S. R., and Incropera, F. P., 1992, “Liquid Immer sion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: 2Forced Convection Boiling,” J. Electron. Packag., 114, pp. 55– 62. 25 Kline, S. J., and McClintock, F. A., 1953, “Describing Uncertainties in Single sample Experiments,” Mech. Eng. Am. Soc. Mech. Eng. , 75, pp. 3–8. 26 Shah, R. K., and London, A. L., 1978, Laminar Flow Forced Convection in Ducts, Advances in Heat Transfer, Suppl. No. 1, Academic, New York. 附件 2：外文原文（復(fù)印件）
畢業(yè)設(shè)計(jì)相關(guān)推薦
鄂ICP備17016276號-1