【正文】 責(zé)進(jìn)行產(chǎn)品 QVL CANDIDATE APPROVAL 作業(yè)系統(tǒng) AT mfg. GCSD . . Field 品質(zhì)改善作業(yè) (EWG) FI 負(fù)責(zé)評估 Project Cost , 決定 Project 是否可行以及 Project 所花費(fèi)之 Cost. Legal 合約及專利審核 Wistron Case Role amp。 Responsibility Function Responsibility PD (Production) PD has to work with PE, PME and IE respectively to get testing equipment amp。D Design Phase Lab Pilotrun Phase Engineering Pilotrun Phase Production Pilotrun Phase Mass Production Phase C0 C1 C2 C3 C4 C5 Check Point Wistron C Phase NPI FDI/MTBF DQA/PQC/ FQC Compatibility/Diagnostic Simulation Test Layout amp。 PreLoad WIH/WPH/WZS/WKS MRS Check Service Cost Estimate Simulation Design Peer Review Lessons Learned Availability Develop Plan Launch FAI amp。 Action DCN/ECN/ECR FAI report PFMEA SQRC Training MTBF Review QMP/QPA/QSA FPYR PPAP Serviceability Design Test Plans Integrate Design Review Signal Quality DFX Index Initial Supplier Audit Memorandum DFMEA Simulation MTBF Estimate MVP Concept/Proposal MRS Definition Scope SCE Investigation amp。 Sourcing Integration Validation Release Product Life Cycle MDRR/C4 Go/ No Go? MRR/C5 Go/ No Go? C6 OOB/OBA ORT/Stress EWG/FQH AFR/DOA New C System Architecture Progress C0 Exit C0 Activity C0 Entry C1 Exit C1 Activity C1 Entry C2 Exit C2 Activity C2 Entry C3 Exit C3 Activity C3 Entry C4 Exit C4 Activity C4 Entry C5 Exit C5 Activity C5 Entry C6 Exit C6 Activity C6 Entry Time Detail Activities ?Subject ?Scope ?Definition ?Procedure ?…. Activities Definition Record amp。 System Maintenance New C System Product Development Proposal Phase Planning Phase Ramp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。D 提出技術(shù)可行性分析 * PM 執(zhí)行可行性及效益評估 審核會(huì)議 C0 目的 評估是否成立專案計(jì)畫，進(jìn)行研發(fā) 檢核項(xiàng)目 計(jì)畫提案書或市場需求規(guī)格書 (MRS) C0工作重點(diǎn)及檢核項(xiàng)目 New C System Product Development Proposal Phase Planning Phase Ramp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 銲錫 1000 PPM Lead (Pb) 鉛 。 telemunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys, leisure amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點(diǎn)及檢核項(xiàng)目 階段 C2設(shè)計(jì)階段 (Ramp。 Thermal Test Plan Invention Disclosure Invention Disclosure New C System Product Development Proposal Phase Planning Phase Ramp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C3 checklist ?HW DV test report ?SW FV test report ?ME test report ?Reliability test report (prel.) ?ME/Artwork packing drawing ?PAL/ROM data listing ?C3 manufacturability review report ?Sample approve status amp。D Design Phase Lab Pilot R