【正文】 but also quality. PSE (Process Engineer) PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP). FAE (Failure Analysis Engineer) or RE FAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable. TE TE is responsible for providing and maintaining Test Plan and Test Program. TE also implement all the preload to production line and report the problems related to preload to preload team. PMC/GPMC (Plan Material Control/ Global Plan Material Control) GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites. Wistron Case Wistron CSystem Quality Control Proposal Phase Planning Phase Ramp。R) ? Process – Cx Stage: ? C0: Proposal phase 構想階段 ? C1: Planning phase 規(guī)劃階段 ? C2: Ramp。D轄下所屬之測試單位人員 ,主要負責各項產(chǎn)品之測試 ,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC., CE/Reliability 組件承認測試 、 不良品故障分析及其他附件等材料品質之管制及保證 產(chǎn)品相關之可靠度與環(huán)境實驗 ， 以及可靠度工程之研究與制定 . PCB PCB Layout之申請、 PCB之設計、 Orcad library amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C3 checklist ?HW DV test report ?SW FV test report ?ME test report ?Reliability test report (prel.) ?ME/Artwork packing drawing ?PAL/ROM data listing ?C3 manufacturability review report ?Sample approve status amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。2kV Bottom cover :177。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點及檢核項目 階段 C2設計階段 (Ramp。 Sourcing Integration Validation Release Product Life Cycle MDRR/C4 Go/ No Go? MRR/C5 Go/ No Go? C6 OOB/OBA ORT/Stress EWG/FQH AFR/DOA New C System Architecture Progress C0 Exit C0 Activity C0 Entry C1 Exit C1 Activity C1 Entry C2 Exit C2 Activity C2 Entry C3 Exit C3 Activity C3 Entry C4 Exit C4 Activity C4 Entry C5 Exit C5 Activity C5 Entry C6 Exit C6 Activity C6 Entry Time Detail Activities ?Subject ?Scope ?Definition ?Procedure ?…. Activities Definition Record amp。D 人員負責產(chǎn)品之開發(fā)、設計、測試規(guī)劃，包括 H/W、 S/W及 ID的開發(fā)、設計、提出新發(fā)明及著作權揭露書 . Wistron Case Role amp。D Ramp。 SPC MTBF Demo CIP/CLCA Pareto Analysis EWG Ready AFR Test Reports PreQVL Ready Diagnostics Program Bug List amp。 sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2022 New C System Product Development Proposal Phase Planning Phase Ramp。12kV Panel Ⅰ : 177。 Spare Parts List 審核會議 C5 目的 檢討試產(chǎn)結果及生產(chǎn)作業(yè)與流程 , 並決定是否進入量產(chǎn) . 檢核項目 試產(chǎn)階段之問題與對策研討 . SCHEDULE檢討 . 量產(chǎn)計劃及備料狀況研討 . 試產(chǎn)階段 YEILD RATE分析與改善對策 New C System Product Development Proposal Phase Planning Phase Ramp。 bug list review ? C5 checklist ? Service Guide ?