【正文】 e product. PD is not just for efficiency only but also quality. PSE (Process Engineer) PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP). FAE (Failure Analysis Engineer) or RE FAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable. TE TE is responsible for providing and maintaining Test Plan and Test Program. TE also implement all the preload to production line and report the problems related to preload to preload team. PMC/GPMC (Plan Material Control/ Global Plan Material Control) GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites. Wistron Case Wistron CSystem Quality Control Proposal Phase Planning Phase Ramp。 Responsibility Function Responsibility CFE CFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not NPI 、協(xié)調(diào)、整合與提供 各 Site製造所需相關(guān)資訊與技術(shù)資料 PE/PME , 產(chǎn)品問題之發(fā)覺及產(chǎn)品移交 . ,克服生產(chǎn)瓶頸 ,提高生產(chǎn)力 . ,進(jìn)行改善以確保產(chǎn)品品質(zhì) . IE . 、杜絕不合理，提高生產(chǎn)力 、製程改善、標(biāo)準(zhǔn)工時製定 QA . PCBA,Final Assembly之檢驗標(biāo)準(zhǔn) QE , MTBF, ORT Test (C4) Wistron Case Role amp。 Mentor library的建立與管理 . 信號品質(zhì) CAE分析 , PCB layout外包廠商之管理， PCB製造廠商之管理 . OS Certification 執(zhí)行公司各產(chǎn)品之 OS 相容性認(rèn)證測試及 LOGO 申請 . . Beta Site 測試 PDM 料號編碼及控管 ,BOM製作 Wistron Case Role amp?！? EMC/Safety All products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請產(chǎn)品之安規(guī)、測試、Debug.. QT 為 Ramp。 Responsibility Function Responsibility HW (Hardware Design) * Hardware is responsible for Electronic Engineering Design * Coworks with S/W and QT to make sure that the every function works well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. SW (Software Design) * Software is responsible for the design of BIOS, Driver, Utilities, and S/W Preload. * S/W coworks with H/W and QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain the bugs/issues information in the bug tracking system. ID/ME (Industrial Design/ Mechanical Engineering) * ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug tracking system used. Wistron Case Role amp。 包括 ME, Thermal, Packing design. 若只寫 SW (Software design) 則指軟體設(shè)計部門有負(fù)責(zé) BIOS, Driver 及 Preload 不同工作性質(zhì)之軟體開發(fā)功能 . Ramp。D Ramp。 Responsibility Function Responsibility PM 產(chǎn)品經(jīng)理 Product Manager (或計畫專案經(jīng)理 Project Manager)為所負(fù)責(zé)計畫或產(chǎn)品線成敗之總負(fù)責(zé)人 , 將依產(chǎn)品線之性質(zhì)指定專人負(fù)責(zé)某類產(chǎn)品 ,必頇對所負(fù)責(zé)產(chǎn)品線專業(yè)領(lǐng)域之發(fā)展及行銷雙方面皆有相當(dāng)程度的了解 . 並依照產(chǎn)品之條件及市場狀況 ,做適當(dāng)?shù)倪\用 ,訂定技術(shù)或產(chǎn)品市場競爭策略 ,並在適當(dāng)?shù)臅r機推出適當(dāng)之技術(shù)或產(chǎn)品 . TM TM is responsible to coordinate technical issues conflict among HW, SW, ID and ME and decisionmaking. TM has to handle all project technical issues. PCC 為規(guī)劃推廣、連絡(luò)及控制專案進(jìn)行的負(fù)責(zé)人 , 掌握專案進(jìn)行之情況以協(xié)助處理異常狀況 , 使新產(chǎn)品能順暢切入工廠且如期推出 , 以提高產(chǎn)品競爭力 . 協(xié)助 Ramp。R) ? Process – Cx Stage: ? C0: Proposal phase 構(gòu)想階段 ? C1: Planning phase 規(guī)劃階段 ? C2: Ramp。CSystem Introduction will cover ? Role amp。 Responsibility (Ramp。D Design phase 設(shè)計階段 ? C3: Lab Pilot Run phase 樣品試作階段 ? C4: Eng Pilot Run phase 工程試作階段 ? C5: PD Pilot Run phase 試產(chǎn)階段 ? C6: Mass Production phase 量產(chǎn)階段 ： ； :； ： Role amp。D RELEASE 開發(fā)階段 BOM CHANGE NOTICE. Ramp。D 包括電子部門及工業(yè)設(shè)計部門 ,若只寫 HW (Hardware Design) 則指電子部門 ,若只寫 ID (INDUSTRIAL DESIGN) 則指工業(yè)設(shè)計部門 。D 人員負(fù)責(zé)產(chǎn)品之開發(fā)、設(shè)計、測試規(guī)劃，包括 H/W、 S/W及 ID的開發(fā)、設(shè)計、提出新發(fā)明及著作權(quán)揭露書 . Wistron Case Role amp。 Responsibility Function Responsibility PA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification) 為產(chǎn)品保證暨開發(fā)支援 Function之總稱 , 主要負(fù)責(zé)根據(jù) MRS/PES 執(zhí)行各項產(chǎn)品之測試 , 諸如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB : PCB LAYOUT, DC : BOM , OS : OS 認(rèn)證 etc。D轄下所屬之測試單位人員 ,主要負(fù)責(zé)各項產(chǎn)品之測試 ,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC., CE/Reliability 組件承認(rèn)測試 、 不良品故障分析及其他附件等材料品質(zhì)之管制及保證 產(chǎn)品相關(guān)之可靠度與環(huán)境實驗 ， 以及可靠度工程之研究與制定 . PCB PCB Layout之申請、 PCB之設(shè)計、 Orcad library amp。 Responsibility Function Responsibility AM (Account Manager) . SAMPLE APPROVAL. . MM (Material Management) is responsible for new supplier development, parts purchasing mechanical tooling status including the schedule, capacity, parts readiness, concerns the dependencies, long leadtime items. also coworks with SQM and CE for ponent quality improvement and the key ponent QVL final version SQM (Supplier Quality Management) * 零件品質(zhì)管理及參與分包商之評鑑 /管理 (SQRC Plan/Status) * 負(fù)責(zé)異常材料分析、追蹤與改善 . * 負(fù)