【正文】 0。無錫圈時加 Realdrill+6mil的點Copy幾個 NPTH作定位 3/1/2023 111五、綠油橋的制作PAD與 PAD之間一般作 ，最小作 2milSMT間綠油橋： SMT間 ?7mil,作 6mil?SMT間 ?7mil,作 3mil的橋5mil?SMT間 ?6mil,作 SMT間 ?5mil,且要求作綠油橋時，要提出咨詢。六、 2OZ底銅 以上印線邊曬網(wǎng)菲林 smydt、 smydb做法：線路菲林正片 +20milmerge線路菲林負片 20milmergedf+6mil負片3/1/2023 112七、金指開窗要求1.一般按 Master做2.要求下移金指開窗，綠油蓋頂?shù)?.凡是金指窗與外層 1： 1， MI無要求蓋頂?shù)模撮_窗3~4mil做4.假手指一定要開窗，如離金指近，最好作整體開窗5.金指開窗兩邊也要伸出 outline10mil,以免殘留綠油 金指底開窗要延伸出 outline10mil或金指導線 3~5mil蓋 線處。6.沉金板有金指時，開窗也要開出 outline10mil.3/1/2023 113八、白字檢測一般白字檢測：1.一 般字體可適當減小 2~3mil，以清晰為準。常規(guī)扦件字符 5~7mil，最小可作 4mil。2.一般白字要用曝光負片 +?7mil掏3.入孔上 PAD白字，一般或去或移，移的太遠要咨詢，要清楚所移白字表示哪些元器件4.大錫面白字保留5.基材位開窗白字一般不去。 (常見于沉金板 )6.白字 Logo(一般作 5~6mil)a.與外層標記不重 b.不能入綠油窗c.不能入鑼孔、鑼槽d.位置正確 3/1/2023 114二、 LPI白字檢測LPI白字適用于底銅厚度在 2OZ以上，有字符印在基材或基材與銅面連接處。需用 LPI工藝作白字時， MI會在白字菲林標注 “LPI”字樣；若沒有 “LPI”字樣，我們按正常白字制作。LPI白字一面需出貨兩張白字菲林 ,一張用作曬網(wǎng) (cmtfss,cmbfss),一張用作曝光 (cmtfdf,cmbfdf),此兩張菲林都需在正常白字菲林(cmtf,cmbf)基礎(chǔ)上完成。1.曬網(wǎng)菲林 (cmtfss,cmbfss)的制作：出正片，字符寬度在正常白字菲林 (cmtf,cmbf)的基礎(chǔ)上加大單邊 10mil，且保證加大后之字符離 NPTH距離 ?5mil。Panel板邊加一個 10mm?60mm的白字塊，以便印油作曝光尺用；板邊字需加上 “LPISS”標識。2.曝光菲林 (cmtfdf,cmbfdf)的制作：出負片，字符寬度在正常白字菲林 (cmtf,cmbf)基礎(chǔ)上整體加大 3mil， 并在單元內(nèi)NPTH孔位上加 1： 1的 PAD給拍板員作對位用 (每單元挑二、三個NPTH即可 )Panel板邊需加上 “LPIdf”標識。 3/1/2023 115第十部分 碳油、藍膠檢測一、碳油菲林檢測1.碳油最小蓋線 ?5mil分兩種情況：a.S/Mopening?PAD,碳油 PAD比外層 PAD大單邊 5milb.S/Mopening?PAD,碳油 PAD比 S/Mopening大單邊 5mil2.碳油 PAD離焊盤距離 ?15mil3.碳油 PAD離孔距離 ?10mil4.碳油 PAD間隙 ?14mil3/1/2023 116二、藍膠菲林檢測藍膠一般在板成型后，交貨之前做，用藍膠覆蓋大金面或大錫面，起保護作用。1.藍膠菲林一般按 Master制作。2.?。3.藍膠蓋 PAD?10mil。4.四角依 Outline形狀加上角形框線 ,線寬 5mil,作對位用。5.藍膠以 PCB形式出貨，板邊字寫于 Outline與 counter之間。 3/1/2023 117Ensure sufficient ring width to prevent broken ring and ensure the connectivityPurpose6 mil (ensure 2 mil ring) Included pensation for etch and layers registrationMinimumRequirementAnnular ringItemAnnular ringHole. Inner layer DFM Item (Annular Ring)3/1/2023 118Ensure the thermal pattern is same as original.PurposeThermal ring: 5 milBreak : 6 milThermal spacing: 6 milMinimumRequirementThermal ringItemHoleThermal ringThermal breakThermal spacing. Inner layer DFM Item (Thermal Pads)3/1/2023 119Ensure the range of finished line width met Customer’s requiredPurpose189。 Oz: + mil1 Oz : + mil2 Oz : + milGeneral practiceEtch pensationItem. Inner layer DFM Item (Etch Compensation)Original LineCompensated LineEtch pensation3/1/2023 120. Inner layer DFM Item (Line Width)Original LineCompensated LineMinimum Line Width Etch pensation3/1/2023 121Process capabilityPurpose Oz: 4 mil Oz: 5 mil Oz: 6 milMinimumRequirementMinimum spacing ItemLine to line spacingLine to pad spacingPad to pad spacing. Inner layer DFM Item (Minimum Spacing)3/1/2023 122Ensure no functionality risk PurposeDrill to copper : 8 milMinimumRequirementDrill to Copper spacingItemLine to hole spacingDrill holePad to hole spacing. Inner layer DFM Item (Drill to Copper)3/1/2023 123Provide spacing to isolate different voltage zonePurpose6 milMinimumRequirementWidth of Isolation zoneItemCopperLaminateInner layer isolation zone. Inner layer DFM Item (Clearance for Isolation)3/1/2023 124Provide spacing to avoid copper exposurePurpose10 milMinimumRequirementInner layer copper clearance from edgeItemCopperLaminateInner layer clearance from Outline. Inner layer DFM Item (Clearance for PCB edges)3/1/2023 125To prevent Inner Copper shorted with slotPurposeBeveling height + 15 milMinimumRequirementInner layer clearance for gold finger areaItemHeight of Beveling Minimum = 15 milLaminate CopperInner layer clearance for gold finger areaGold fingers Inner layer DFM Item (Clearance for Beveling )3/1/2023 126Ensure sufficient clearance for PCB unit edgesPurpose10 milMinimumRequirementInner layer clearance for VcutItem Inner layer DFM Item (Clearance for vcut path)Inner layer clearance for Vcut pathLaminateCopper3/1/2023 127Conductive channel of BGA areaTo prevent isolated thermals caused functional openPurpose6 milMinimumRequirementConductive channel of BGA area (Power ground plane)Item Inner layer DFM Item (Conductivity Channel)3/1/2023 128Prevent open short caused by dry film peel offPurposeSize under 4 mil removedMinimum requirementSliver removalItemSliverDry film Inner layer DFM Item (Small Air Gap)3/1/2023 129Ensure sufficient ring width to prevent broken ring and ensure the connectivityPurposeTake drill layer or other specified as reference, shift circuitry imageGeneral practiceRegistrationItemBefore registration After registration Inner layer DFM Item (Registration)3/1/2023 130Increase production yieldPurposeRefer to following figure1, 2Restrict for special CustomerGeneral PracticeTeardropItem Inner layer DFM Item (Inner Layer Teardrop Pads)Option1GeneralPracticeOption247 mil47 mil3/1/2023 131 Outer layer DFM Items (Etch Compensation)Ensure the range of finished line width and SMD pads met Customer’s requiredPurpose189。 Oz: + mil1 Oz : + mil2 Oz : + milGeneral PracticeEtch pensationItemEtch Compensation3/1/2023 132Ensure sufficient ring width to prevent broken ring and ensure the connectivityPurposeTake drill layer or other specified as reference, shift circuitry imageGeneral PracticeRegistrationItemRegistration Outer layer DFM Items (Registration)3/1/2023 133Ensure the Non Plat Through Hole is protected by Dry Film Purpose10 milMinimum requirementNPTH to CuItemSpacing of NPTH to CuNonplated through holeCopperLaminate Outer layer DFM Items (Spacing between NPTH and Cu)3/1/2023 134Ensure sufficient ring width to prevent broken ring and ensure the connectivityPurpose5 milMinimumRequirementAnnular ringItemWidth of annular ring Outer layer DFM Items (Annular Ring)3/1/2023 135Pad to pad spacingLine to line spacingLine to pad spacing Outer layer DFM Items (Spacing)3/1/2023 136Process capabilityPurpose1/3 Oz: 3 mil。 Oz: 3 mil。 Oz: 5 milMinimumRequirementMinimum line width (Outer layer)ItemOriginal LineCompensated LineEtch pensationMinimum Line Width Outer laye