電路板制作流程-資料下載頁(yè)
2025-07-23 19:31本頁(yè)面
【正文】 Hot Press Hot Press COPPER FOIL OZ Thin Core ,FR4 prepreg COMP S0LD. prepreg Thin Core ,FR4 prepreg COPPER FOIL OZ Caul Plate Caul Plate PCB Manufacturing Process introduction P 17 Laminate Shear (Panel Size) COPPER FOIL Epoxy Glass Photo Resist Dry Film Resist Coat (Inner Layers) PCB Manufacturing Process introduction P 18 Expose After Expose Artwork Artwork Photo Resist UV Light PCB Manufacturing Process introduction P 19 Develop Photo Resist Power/Ground/Signal (Etch) Photo Resist PCB Manufacturing Process introduction P 20 Oxide Treatment Strip Resist PCB Manufacturing Process introduction P 21 Layup Layer 1 Layer 2 Layer 3 Layer 4 Copper Foil Copper Foil Inner Layer Prepreg Prepreg PCB Manufacturing Process introduction P 22 Lamination (Drill amp。 Deburr) (.amp。 Blind Via) BackUp Entry Material PCB Manufacturing Process introduction P 23 Desmear amp。 Copper Deposition D/F Photo Resist Coat Photo Resist PCB Manufacturing Process introduction P 24 Expose (OuterLayer) After Expose UV PCB Manufacturing Process introduction P 25 Develop (酸性蝕刻 ) (Etch) PCB Manufacturing Process introduction P 26 Strip Resist Solder Mask Coat PCB Manufacturing Process introduction P 27 Expose 21. 顯影 Develop UV S/M A/W PCB Manufacturing Process introduction P 28 Legend (Silk Screen) (浸金 …… ) HAL,Immersion gold…… R105 WWEI 94V0 R105 WWEI 94V0 PCB Manufacturing Process introduction P 29 Positive Acting (working) PCB Manufacturing Process introduction P 30 Negative Acting (working)
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