電路板制作流程-資料下載頁
2025-07-23 19:31本頁面
【正文】 Hot Press Hot Press COPPER FOIL OZ Thin Core ,FR4 prepreg COMP S0LD. prepreg Thin Core ,FR4 prepreg COPPER FOIL OZ Caul Plate Caul Plate PCB Manufacturing Process introduction P 17 Laminate Shear (Panel Size) COPPER FOIL Epoxy Glass Photo Resist Dry Film Resist Coat (Inner Layers) PCB Manufacturing Process introduction P 18 Expose After Expose Artwork Artwork Photo Resist UV Light PCB Manufacturing Process introduction P 19 Develop Photo Resist Power/Ground/Signal (Etch) Photo Resist PCB Manufacturing Process introduction P 20 Oxide Treatment Strip Resist PCB Manufacturing Process introduction P 21 Layup Layer 1 Layer 2 Layer 3 Layer 4 Copper Foil Copper Foil Inner Layer Prepreg Prepreg PCB Manufacturing Process introduction P 22 Lamination (Drill amp。 Deburr) (.amp。 Blind Via) BackUp Entry Material PCB Manufacturing Process introduction P 23 Desmear amp。 Copper Deposition D/F Photo Resist Coat Photo Resist PCB Manufacturing Process introduction P 24 Expose (OuterLayer) After Expose UV PCB Manufacturing Process introduction P 25 Develop (酸性蝕刻 ) (Etch) PCB Manufacturing Process introduction P 26 Strip Resist Solder Mask Coat PCB Manufacturing Process introduction P 27 Expose 21. 顯影 Develop UV S/M A/W PCB Manufacturing Process introduction P 28 Legend (Silk Screen) (浸金 …… ) HAL,Immersion gold…… R105 WWEI 94V0 R105 WWEI 94V0 PCB Manufacturing Process introduction P 29 Positive Acting (working) PCB Manufacturing Process introduction P 30 Negative Acting (working)
研究報(bào)告相關(guān)推薦
鄂ICP備17016276號(hào)-1