【正文】 ed ceramic chip carrier (LDCC)………………………………………………………...Leadless ceramic chip carrier (LCCC)……………………………………………………….Local fiducial mark……………………………………………………………………………Low speed placement equipment……………………………………………………………..Low temperature paste……………………………………………………………………….. MMachine inspection……………………………………………………………………………Mass soldering…………………………………………………………………………………Metal electrode face (MELF) ponent。 cylindrical…………………………………………Metal stencil。 stencil……………………………………………………………………………Miniature plastic leaded chip carrier…………………………………………………………. NNoclean solder, paste…………………………………………………………………………Nozzle…………………………………………………………………………………………. OOffline programming………………………………………………………………………….Optic correction system……………………………………………………………………….. PPaste/adhesive application inspection………………………………………………………….Paste separating………………………………………………………………………………...Paste shelf life………………………………………………………………………………….Paste working life………………………………………………………………………………Percentage of metal…………………………………………………………………………….Pick and place………………………………………………………………………………….Pin transfer dispensing…………………………………………………………………………Placement accuracy……………………………………………………………………………Placement direction……………………………………………………………………………Placement equipment。 pickplace equipment。 chip mounter。 mounter………………………..Placement head…………………………………………………………………………………Placement inspection……………………………………………………………………………Placement pressure………………………………………………………………………………Placement speed…………………………………………………………………………………Plastic leaded chip carriers(PLCC)……………………………………………………………..Precise placement equipment…………………………………………………………………… uad flat pack(QFP)……………………………………………………………………………. RRectangular chip ponent…………………………………………………………………….Reflow atmosphere……………………………………………………………………………...Reflow soldering…………………………………………………………………………………Resolution……………………………………………………………………………………….Repeatability…………………………………………………………………………………….Rework rtation…………………………………………………………………………………Reworking……………………………………………………………………………………..Rheologic modifiers……………………………………………………………………………Rotating deviation……………………………………………………………………………… SScreen, printer………………………………………………………………………………….Screen printing………………………………………………………………………………….Screen printing plate……………………………………………………………………………Self alignment…………………………………………………………………………………..Sequential placement……………………………………………………………………………Shifting deviation………………………………………………………………………………..Shrink small outline package(SSOP)……………………………………………………………Simultaneous placement………………………………………………………………………...Single condensation systems……………………………………………………………………Skewing………………………………………………………………………………………….Slump……………………………………………………………………………………………Small outline diode(SOD)……………………………………………………………………….Small outline integrated circuit (SOIC)………………………………………………………….Small outline package (SOP)…………………………………………………………………….Small outline transistor (SOT)……………………………………………………………………Snapoffdistance………………………………………………………………………………..Solder balls………………………………………………………………………………………Solder paste。 cream solder……………………………………………………………………….Solder powder……………………………………………………………………………………Solder shadowing………………………………………………………………………………..Squeegee………………………………………………………………………………………...Stencil printing…………………………………………………………………………………..Stickfeeder………………………………………………………………………………………Stringing…………………………………………………………………………………………Surface mounted assemblys (SMA)……………………………………………………………..Surface mounted ponents/surface mounted devices (SMC/SMD)………………………….Surface mount technology (SMT)……………………………………………………………….Surface mount solder joints………………………………………………………………………Syringe dispensing……………………………………………………………………………… TTape feeder………………………………………………………………………………………Tapepak packages……………………………………………………………………………….Teach mode programming……………………………………………………………………….Terminations……………………………………………………………………………………..Thixotropy……………………………………………………………………………………….Tray feeder……………………………………………………………………………………… VVapor phase soldering (VPS)……………………………………………………………………Visual inspection………………………………………………………………………………… WWave soldering………………………………………………………………………………….Wicking………………………………………………………………………………………….附加說明：本標準由電子工業(yè)部標準化研究所歸口。本標準由電子工業(yè)部工藝研究所負責起草。本標準主要起草人：邢華飛、高顯明、范治華、攸寶成、李尚厚。16 / 16