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【正文】 to add thin film on surface. Coating of an object with a thin layer of metal by use of electricity. A classical method to ―grow‖ metal onto surface Typical materials used for plating: Cu, Au, Ag, Cr Thickness 100um 7. Micro Fabrication Technologies （一） Surface micromachining （二） Bulk micromachining concept for Bulk Micromachining 1) Selectivity—A process is selectivity if it etches the desired direction at a higher rate and all other surface at a lower rate. 2) Isotropic Same etching rate at all directions. 3) Anisotropic– direction selected 4) Wet etching This is the simplest etching technology. All it requires is a container with a liquid solution that will dissolve the material in question. Isotropic enchants (HNA):HF,HNO3,CH3COOH Anisotropic enchants: KOH, EDP, TMAH 176。 (100) 100 Note: the advantage of wet etching is that you will get good selectivity, but hard to control etch rate. 5) Dry etching a. Plasma etch polySi :Cl, F based gases, such as Cl2, CF4 Oxides: CHF3, C2F6 etc. b. RIE( reactive iron etch ) c. DRIE （三） Surface vs. Bulk micromaching Surface micromaching Bulk micromaching Surface Micromachining Bulk Micromachining Trench Bridge Cantilevers Wafer Surface Cavity Nozzle Membrane （四） LIGA (Lithographic, Galvanoformung, Abformung) (Deep xray lithography, electroplating, molding) 1) Development and Electroplating 2) Molding 3) LIGA vs. Si microlithography （五） CMOS process
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