至卓飛高線路板公司沉銀工序培訓(xùn)教材ppt-管理培訓(xùn)-資料下載頁
2025-08-09 13:07本頁面
【導(dǎo)讀】沉銀我公司使用了兩家公司的藥水,開工后即可進(jìn)行調(diào)節(jié)藥水并進(jìn)行首板生產(chǎn)。水中，下班開工時再安裝回原位。H2O2:5%；H2SO4:％；100M:5％；100S:1％；，220Micro:；H2SO4(98%):,檸檬酸：;DI水至開缸液位;7開啟泵浦,循環(huán)30min.DI水再浸洗3-4小時;6直到水洗PH值>;
【正文】 甩銀或嚴(yán)重的露銅 /發(fā)黃 ,須使用ENTHONE的褪銀藥水 PC6520褪銀后再過全線一次 TOPSEARCH PRINTED CIRCUITS (QUJIANG) LTD. 至卓飛高線路板 (曲江 )有限公司 17 十二、常見問題處理 TOPSEARCH PRINTED CIRCUITS (QUJIANG) LTD. 至卓飛高線路板 (曲江 )有限公司 General Process Problem Possible Causes amp。 Solution Yellowing ? Insufficient HNO3 in ImmAg bath (add HNO3 at ml/L increment) ? Cu surface oxidized before ImmAg (check pretreatment) Patchy Ag Surface ? Uneven etching at pretreatment (check pretreatment) ? Rough ining Cu surface (scrub before AlphaSTAR process) ? Dirty rollers after each chemical bath (clean the rollers) Ag appearance too matte ? Low/no etching at AlphaSTAR 100 (adjust conc. or change bath) ? Serious etching at microetch (add more Citric Acid) Insufficient Ag Thickness ? Low [Ag] at ImmAg bath (add AlphaSTAR Silver) ? Low temp. at ImmAg bath (check temp. setting) ? Too fast conveyor speed (slow down the speed) Exposed Cu ? Contamination on ining Cu surface (scrub before process) ? Contamination on Cu surface after microetch (clean the rollers from postmicroetch rinse to predip) Poor Ag Adhesion ? Cu surface contamination before ImmAg bath (check source of contamination) ? Dirty rollers in ImmAg bath (clean the rollers) 18 Thank You !
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