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tal failure rate for both Sku were % (28 fail / 164 built) and % (24 fail / 80 built) ? 經(jīng)過挑選后短路的分別為不良率 為 %,FRODO 30% ? Debug was done in the same date, engineering found the problem was related toPCB. The PCB for both Pippin and Frodo were the same: 28603507. All PCB came from Compeq in Taiwan and the D/C was 1406 ? 問題與 PCB有關(guān) ﹐ PCB是從 臺灣購買 的 ﹐ 周期是 1406. Discipline 3: Implement Containment Actions(執(zhí)行圍堵行動) HOW怎樣把不良品圍堵 ﹖ WHO(由誰來完成?) WHEN(什么時候完成?) 目標(biāo): ?購買時間讓團(tuán)隊能針對問題找出真因。 ?保護(hù)內(nèi)外顧客在永久改正行動執(zhí)行之前免受到問題之影響。 ?從成本、質(zhì)量、時效的層面來控制問題。 D3: Implement Containment Actions ? Purged all PCB 28603507 from Compeq. ? Total264 pcs were received from Compeq on 2/17/14 ? All of them had been used for assembly and no PCB left ? Shipped out Q’ty: 0 PCS ﹐ Need not call back . ? PIC: BobDue day 3/28/14 ? 清除所有 COMPEQ 28603507的 PCB ? 總數(shù)量 264 PCS,所有的均已組裝 ﹐ 沒有空 PCB剩留 ? 出貨數(shù)量為 ﹕ 0 PCS無需召回 ? 負(fù)責(zé)人 ﹕ Peter 完成日期 ﹕ 2023/3/28 Discipline 4: Verify Root Cause(確認(rèn)真因) 目標(biāo):鑒別真因 (Root Cause)并以事實(shí)證明 鑒別所有可能可以解釋為何問題發(fā)生之各項原因,相對問題說明及測試數(shù)據(jù)以測試每一項潛在之可能原因來隔離并驗(yàn)證真因,鑒別替代改正措施以消除真因。 定義 (Occurrence):問題發(fā)生的地點(diǎn)或站別 (Escape):最接近根本原因之生產(chǎn)過程中位置,在該處應(yīng)可測知問題,但卻被忽略 (Possible Causes):任何可能在問題描述發(fā)生影響之原因 (Likely Causes):可能數(shù)種原因會使問題斷續(xù)發(fā)生,無法依據(jù)現(xiàn)有系統(tǒng)可以排除 因 (Root Cause):經(jīng)過驗(yàn)證為引發(fā)問題的單一原因 ?亂丟煙蒂導(dǎo)致失火 ?煙霧偵測器失效 ?大樓管理室沒有偵測到 ?失火 Occurrence Escape Escape 多發(fā)問“ WHY? WHY? WHY? …… Discipline 5: Corrective Action(矯正行動)