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VTNNwellPAPTVTPPolyNLDD implantNLDD 114 mask PLDD 113 maskPLDD implant Process Cross sectionPoly PLDDPLDD NLDDP SubstrateNLDDPwellNAPTVTNNwellPAPTVTPPolyPLDD 197 mask ( )Ppocket/PLDD impNLDD 116 mask ()NLDD21 As/NLDD22P31 imp Process Cross sectionPoly P SubstratePwellNAPTNwellPAPTVTPPolyPSD NSD NSD NSDPSD PSDPSD 197 maskNSD 198 maskNSD imp Process Cross sectionPoly P SubstratePwellNAPTNwellPAPTVTPPolyPSD NSD NSD NSDPSD PSD Process Cross sectionPoly P SubstratePwellNAPTNwellPAPTVTPPolyPSD NSD NSD NSDPSD PSDW W W WILDTrench oxide Process Cross sectionPolyi P SubstratePwellNAPTNwellPAPTVTPPolyPSD NSD NSD NSDPSD PSDW W W WILDTrench oxide Process Cross sectionPoly P SubstratePwellNAPTNwellPAPTVTPPolyiPSD NSD NSD NSDPSD PSDW W W WILDTrench oxideIMD1W W W W Process Cross sectionPoly P SubstratePwellNAPTNwellPAPTVTPPolyPSD NSD NSD NSDPSD PSDW W W WILDTrench oxideIMD1W W W WMetal1Metal2 Process Cross sectionMetal1IMD1ASi PwellNAPTNwellPAPTVTPPolyPSD NSD NSD NSDPSD PSDW W W WILDTrench oxideMetal4IMD4W WWIMD5Metal6IMD3W WMetal2IMD2Metal_5W WWW WWWWPCMuPCM就是 Process Control Monitor的簡稱;u同時, PCM也稱為 WAT: Wafer Accept Test;PCM Purpose PCM 主要把線上一些工藝異常進行及時的反映,在產(chǎn)品入庫前對其進行最后一道質(zhì)量的檢驗,其作用歸納起來,主要有如下幾點: ( 1) 對產(chǎn)品進行參數(shù)質(zhì)量檢驗; ( 2)監(jiān)控在線工藝對電參數(shù)的影響,以及工藝的波動; ( 3)判定 WAFER PASS/FAIL的一個重要依據(jù),客戶會根據(jù) PCM 測試情況,決定接收、或拒收 WA