電解銅箔論文：添加劑對(duì)電解銅箔組織性能的影響及優(yōu)化(編輯修改稿)
2024-07-21 02:58 本頁面
【文章內(nèi)容簡(jiǎn)介】 nement and allowing the microscopic roughness of the copper foil to be lower. PEG also has the ability to inhibit the deposition of metal impurities and prevent the growth of abnormal grain. But excess PEG will reduce the tensile strength and elongation of copper foil at high temperature. The leveling and refinement effect of gelatin are well. It can improve the tensile strength and elongation of copper foil at room temperature, but reduce the tensile strength and elongation of copper foil at high temperature. And the effect of bone glue is better than collagen. RE element can obviously improve mechanical properties of the copper foil by refining and uniformly distributing grain size in the foil, where ideal grain size in the copper foil with maximum value mechanical properties can be obtained with approximately 6 mg/L RE content. The effects of different additive formula on the microstructure of bright side, mechanical properties and internal stress of electrodeposited copper foil are investigated by the orthogonal test and the best 3 additive formulas were gotten by visu
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