電解銅箔論文：添加劑對電解銅箔組織性能的影響及優(yōu)化(文件)
【正文】 h temperature. And the effect of bone glue is better than collagen. RE element can obviously improve mechanical properties of the copper foil by refining and uniformly distributing grain size in the foil, where ideal grain size in the copper foil with maximum value mechanical properties can be obtained with approximately 6 mg/L RE content. The effects of different additive formula on the microstructure of bright side, mechanical properties and internal stress of electrodeposited copper foil are investigated by the orthogonal test and the best 3 additive formulas were gotten by visual diagram and data analysis. The best ratio of formula was proved by experiments:Gelatin、PEG、SP、HEC was mg/L、 mg/L, respectively. The internal stress and defects of copper foil was reduced, microstructure of bright side was:twin of %, (111) texture of % and the average grain size of . The grains on rough surface were distributed more uniformly and mechanical properties of copper were improved as well。制備出的銅箔內(nèi)應(yīng)力減少,銅箔缺陷也有所減少,亮面晶粒微觀結(jié)構(gòu)：孿晶(界)%,(111)%,毛面晶粒分布較均勻,銅箔力學(xué)性能也能提高,其中常溫和高溫抗拉強(qiáng)度分別是： MPa、,常溫和高溫延伸
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