電解銅箔論文：添加劑對(duì)電解銅箔組織性能的影響及優(yōu)化(存儲(chǔ)版)
【正文】 ghness and improve the mechanical properties, especially for elongation at room temperature. Copper foil with maximum value prehensive properties can be obtained with approximately mg/L SP content. HEC can promote the growth of grainoriented and ensure copper foil has certain roughness and improve the mechanical properties at room temperature, but reduce the tensile strength of foil at high temperature. HEC also can inhibit the pinhole, but cause copper foil warp. PEG can increase the depositon overpotential and promote the growth of grainoriented, resulting in grain refinement and allowing the microscopic roughness of the copper foil to be lower. PEG also has the ability to inhibit the deposition of metal impurities and prevent the growth of abnormal grain. But excess PEG will reduce the tensile strength and elongation of copper foil at high temperature. The leveling and refinement effect of gelatin are well. It can improve the tensile strength and elongation of copper foil at room temperature, but reduce the tensile strength and elongation of copper foil at high tem
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