電解銅箔論文：添加劑對電解銅箔組織性能的影響及優(yōu)化-免費閱讀
【正文】 通過正交試驗,研究了不同添加劑配方對銅箔亮面晶粒微觀結構、力學性能,以及內應力的影響,利用直觀圖示和數(shù)據(jù)分析得出了最優(yōu)的3種添加劑配方,經(jīng)過試驗驗證確定了添加劑最佳配比為：明膠、PEG、SP、 mg/L、 mg/L、。HEC能促使晶粒面向生長,抑制針孔,但會引起銅箔翹曲。本文利用SEM、微機控制萬能試驗機、高溫拉伸機、電子背散射衍射分析技術、應力儀研究了聚二硫二丙烷磺酸鈉(SP)、羥乙基纖維素(HEC)、聚乙二醇(PEG)、明膠、稀土鈰鹽等添加劑單獨及共同作用時對銅電沉積的影響。明膠具有細化晶粒和整平的效果,能夠保證銅箔具有一定的粗糙度和提高銅箔常溫抗拉強度和延伸率,但會降低銅箔高溫抗拉強度和延伸率?！居⑽恼縏he electrodeposition of Cu has been a subject of recent extensive investigations because of electrodeposition copper foils have been widely used the conductors for printed circuit boards (PCBs). Additives play a major role in controlling the properties of copper foils, even small amounts of certain additives can affect the properties and aspect of the effect of bis(3sulfopropyl) disulfide (SP), hydroxyethylcellulose (HEC), polyethylene glycol (PEG), gelatin and cerous sulfate on the copper electrodeposits are investigated by SEM (scanning electron microscope), microputer control electronic universal testing machine, high temperature drawing machine, EBSD(electron backscattered diffraction) and stress gauge. The results reveal that SP can decrease the surface rou
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