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n set up and evaluate packing profiles to determine the optimal packing pressure and duration of packing. Using the packing analysis results, mold designers can identify areas of high, nonuniform volumetric shrinkage that could contribute to part warpage and view the distribution of cooling time to identify areas that dictate cycle time. The warpage indicator analysis shows the deflected shape of a part—a valuable tool in visualizing the part shrinkage and warpage. Mold designers can also scale the deflected shape for better visualization of part deformation. Using this tool to view the shape of the part, mold designers can evaluate specific areas of the part that need to be within specified warpage levels. The warpage indicator result is a trafficlight (red, yellow, green) plot that highlights the areas where part warpage exceeds a userspecified, acceptable warpage level relative to a userspecified reference plane. Using this tool, mold designers can evaluate whether changes made to the part or mold design, or to the material or process conditions, will bring the part warpage to within acceptable levels. The cooling module simulates the cooling phase of the injection molding process so that users can optimize mold designs for uniform cooling and minimum cycle times. Mold designers can leverage several options to design their cooling circuits, including importing from a CAD system, using an automatic wizard, or using m