熱分析的基本參數(shù)與概念(更新版)
【正文】 。θjb通常的測(cè)量位置在電路板上靠近封裝處。Tjunction=TPCB+ ( Ψjb * Power ) ΨjcTjunction=Tcase+ ( Ψjc * Power ) (此時(shí)不能加散熱片) 各種封裝的散熱效果由圖可見(jiàn)，BGA封裝的散熱效果最佳。5 Conclusions6 Abbreviations, Definitiones, Glossary7 VersionVersionCommentsDateRevision by0001Initial18/12/2015Bai Page 13 of 13 Doc. No.: WI00000Ver No.: 01Ver Date: 00MMM2014Information included in this document is the property of IEE . Copy, use or disclosure of its contents, even in part, is not permitted without the prior written agreement of IEE. This document is strictly IEE confidential.
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