熱分析的基本參數(shù)與概念-閱讀頁(yè)
2025-07-12 06:01本頁(yè)面
【正文】 PCB設(shè)計(jì)中注意保證器件底部的過(guò)孔數(shù)量。θjc只有那種特別大的封裝才有意義TO220，同時(shí)附加有散熱片因?yàn)橹苯觽鲗?dǎo)占據(jù)最主要的比例。目前針對(duì)電路的芯片節(jié)溫估算，由于環(huán)境溫度為85℃，只能得到環(huán)境溫度信息，PCB板或者芯片的Case的溫度均不能得到，故只能使用θja 進(jìn)行大致估算。5 Conclusions6 Abbreviations, Definitiones, Glossary7 VersionVersionCommentsDateRevision by0001Initial18/12/2015Bai Page 13 of 13 Doc. No.: WI00000Ver No.: 01Ver Date: 00MMM2014Information included in this document is the property of IEE . Copy, use or disclosure of its contents, even in part, is not permitted without the prior written agreement of IEE. This document is strictly IEE confidential.
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