【正文】 Feed RateSpindle SpeedWater TypeWater ResistivityWafer Saw (Use if Applicable)Equipment Make and Model numberBlade TypeFeed RateSpindle SpeedWater TypeWater ResistivitySMT (Use if Applicable)SMT Line Number or individual equipment numbersProvide Reflow Profile Graph of Qual lot (repeat for qualification lot 2 and 3). Profile to be obtained pre lot for all qual lots.Provide data:Time above LiquidousPeak TemperatureTime to 150176。 Purpose目的This document provides templates for recording package qualification data for RFMD product and instructions for plying with Materials Declaration.提供記錄RFMD產(chǎn)品考核認(rèn)證所需信息資料的模板,及遵從物質(zhì)申明的說(shuō)明 Scope范圍Apply to RFMD package qualification適用于RFMD考核認(rèn)證產(chǎn)品 Instruction說(shuō)明 Materials Declaration: The Subcontractor Assembly house is required to submit Materials Declaration forms listing the required banned, banned with acceptable threshold level, reportable or other materials required by RFMD QAL211028 for assemblies manufactured for RFMD. These are required for current and new assemblies and must be updated whenever material changes occur or whenever a new substrate process development or assembly qualification begins. The supplier will be required to provide proof of pliancy with a chemical analysis. See QAL211028 for details on requirements, reporting structure, and reporting format.物質(zhì)申明: 外包封裝廠需要提交物質(zhì)聲明書，列明禁用材料，禁用但可接受門限的材料、需告知的或其他由RFMD QAL211028文件規(guī)定的用于RFMD封裝制造產(chǎn)品的材料. 這些規(guī)定適用于現(xiàn)有及未來(lái)新的封裝產(chǎn)品,當(dāng)材料變更,新基板工藝流程的開(kāi)發(fā)或開(kāi)始封裝考核認(rèn)證時(shí)都要提交該聲明書. 供應(yīng)商還需要提供化學(xué)分析作為依據(jù). 參考QAL211028文件中的詳細(xì)要求,報(bào)告的結(jié)構(gòu)和格式。 Add lines, insert tables, embed objects at each applicable process step to capture pertinent process data.各工序可根據(jù)需收集的相關(guān)信息資料增加表格的行數(shù), 插入新的表格和對(duì)象 Compress pictures once all applicable process information has been inserted. Go to view toolbars, select pictures. Go to pictures toolbar and press pictures, OK.完成相應(yīng)的所有工序的信息資料后壓縮圖片. 在視圖工具欄中選擇圖片后壓縮或在圖片工具欄欄中壓縮圖片 Reference參考CSRCM012（PKG211013） Subcontractor Assembly Specification for ModulesCSRCM029（QAL211028） Banned Substances List and RFMD Green Definition Qualification Data考核評(píng)估資料擬制：審核：批準(zhǔn)：Qualification DataPart Number Qual Lot Number Trace Code Package TypePackage Size ThicknessWafer Size Thickness (list all die)Lead CountPO NumberMSL Target Level Assembly LocationBonding Diagram Part NumberBOM Part NumberBranding Diagram Part NumberPrepared ByExecutive SummaryYield SummaryLot 1 Lot 2 Lot 3 Total YieldSMT YieldLot 1 Lot 2 Lot 3 Total YieldAssy YieldLot 1 Lot 2 Lot 3 Total YieldFinal YieldData Summary All Lots bined ProcessTestCriteria177。CTime above 150176。 hardness/metal) and AngleBlade ForceBlade SpeedSeparation speed amp。 opening X,Y distance(s)Paste Print Process Parameters:Blade type (plastic amp。 distanceProvide sample picture of solder paste print.Flux Thickness (if applicable), (repeat for lots 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg ST1 Paste Thickness, (repeat for lots 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg ST1 0402 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg 0201 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg 01005 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg Add rows or columns for any other size / shape surface mount ponent not listed. Perform same quantity of shears and listed data gathering requirements.Flange Packages (if applicable)Pre Flange Flatness Measurement – Data per ten flanges Measure five locations per flange, center and four corners.Flange Flatness, (repeat for lot 2 and 3) 1 2 3 4 5 Min Max Avg F1F2F3F4F5F6F7F8F9F10Die AttachEquipment Make and Model numberAttach MethodParametersDie Placement, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1xD1yD2xD2yD3xD3yD4xD4yD5xD5yDie Shear, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Die Rotation in Degrees, (repeat for lot