封裝考核評(píng)估資料匯編-文庫(kù)吧
2025-03-23 21:11 本頁(yè)面
【正文】 Description Value TypeCapacitorResistorInductorBackgrind (Use if Applicable)Equipment Make and Model numberBlade TypeFeed RateSpindle SpeedWater TypeWater ResistivityWafer Saw (Use if Applicable)Equipment Make and Model numberBlade TypeFeed RateSpindle SpeedWater TypeWater ResistivitySMT (Use if Applicable)SMT Line Number or individual equipment numbersProvide Reflow Profile Graph of Qual lot (repeat for qualification lot 2 and 3). Profile to be obtained pre lot for all qual lots.Provide data:Time above LiquidousPeak TemperatureTime to 150176。CTime above 150176。CReflow profile nameNitrogen oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMFlux Printing (for Flip Chip – use if applicable)Attach sample picture for each die.Flux Stencil Parameters:Stencil ThicknessStencil MaterialAperture Opening Design – (Special design and % of solder mask or metal opening)Flux Print Process Parameters:Blade type (plastic amp。 hardness/metal) and AngleBlade ForceBlade SpeedSeparation speed amp。 distance Solder Stencil Parameters:Stencil ThicknessStencil MaterialAperture Opening Design – (Special design and % of solder mask or metal opening)For Flip Chip – Recess Z depth amp。 opening X,Y distance(s)Paste Print Process Parameters:Blade type (plastic amp。 hardness/metal) and AngleBlade ForceBlade SpeedSeparation speed amp。 distanceProvide sample picture of solder paste print.Flux Thickness (if applicable), (repeat for lots 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg ST1 Paste Thickness, (repeat for lots 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg ST1 0402 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg 0201 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg 01005 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg Add rows or columns for any other size / shape surface mount ponent not listed. Perform same quantity of shears and listed data gathering requirements.Flange Packages (if applicable)Pre Flange Flatness Measurement – Data per ten flanges Measure five locations per flange, center and four corners.Flange Flatness, (repeat for lot 2 and 3) 1 2 3 4 5 Min Max Avg F1F2F3F4F5F6F7F8F9F10Die AttachEquipment Make and Model numberAttach MethodParametersDie Placement, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1xD1yD2xD2yD3xD3yD4xD4yD5xD5yDie Shear, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Die Rotation in Degrees, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Flip Chip Attach (if applicable)Equipment Make and Model numberProvide Reflow Profile Graph of Qual lot (repeat for qualification lot 2 and 3) if different from SMT reflow profile. Profile to be obtained pre lot for all qual lots.Provide data:Time above liquidousTime to 150176。CTime above 150176。CReflow profile nameNitrogen Oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMAttach MethodParametersNeedle (per die):Provide image of push up pin configuration. Provide sample picture of back side of die.Provide sample picture of bumps after die placement (per die). Remove die from board.Manual die peeling after reflow. Five samples and attach a sample picture of die and board.Die Height, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Die Shear, (repeat for lot 2 and 3) 1 2
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