【正文】 條件 .............................................................................................................8 . 乾燥（烘烤）限制 ...............................................................................................................8 . 防潮儲存條件 ......................................................................................................................8 . 錫膏之規(guī)定 .................................................................................................................................9 2. ........................................................................................................... 鋼網(wǎng)印刷制程規(guī)範(fàn) 11 . 刮刀 ........................................................................................................................................ 11 . 鋼板 ........................................................................................................................................ 11 . 真空支座 ................................................................................................................................. 12 . 鋼網(wǎng)印刷的參數(shù)設(shè)定 ................................................................................................................. 13 . 印刷結(jié)果的確認(rèn) ....................................................................................................................... 13 3. .......................................................................................................... 自動光學(xué)檢測 (AOI) 15 . AOI 一般在生產(chǎn)線中的位臵 ....................................................................................................... 15 . AOI 檢查的優(yōu)點 ....................................................................................................................... 15 . 元件和錫膏的抓取報警設(shè)定 ....................................................................................................... 15 4. ................................................................................................................. 貼片製程規(guī)定 15 . 吸嘴 ........................................................................................................................................ 16 . Feeders .................................................................................................................................. 16 . NC程式 .................................................................................................................................. 16 . 元件數(shù)據(jù) /目檢過程 .................................................................................................................. 16 . Placement process management data patibility table？ ................................................ 17 5. ...................................................................................................... 回焊之 PROFILE量測 18 . Profile 量測設(shè)備 ...................................................................................................................... 18 . 用標(biāo)準(zhǔn)校正板量測 PROFILE之方法 .......................................................................................... 18 6. ................................................................................................................. 標(biāo)準(zhǔn)有鉛製程 20 4 . 建議回焊爐設(shè)臵 ....................................................................................................................... 21 7. ................................................................................................................. 無鉛焊接製程 23 . 無鉛製程之 profile 定義 ............................................................................................................ 23 . 無鉛製程 profile 一般規(guī)定 ........................................................................................................ 23 . 無鉛製程標(biāo)準(zhǔn)校正板之 profile 基本規(guī)定 .................................................................................... 25 . 無鉛製程啟動設(shè)臵 .................................................................................................................... 25 . 對 PCB 的回焊 profile 量測 ...................................................................................................... 26 8. .......................................................................................................................點膠製程 28 . 概要 ........................................................................................................................................ 28 . CSP元件點膠方式 ................................................................................................................... 29 9. ................................................................................................ 手工焊接製程以及手工標(biāo)準(zhǔn) 31 10. 目檢相關(guān)規(guī)定，不良判定標(biāo)準(zhǔn)，不良分類以及培訓(xùn)資料 ............................................................... 31 11. 相關(guān)文件 ................................................................................................................................. 31 5 1. 運輸、儲存和生産環(huán)境 . 一般運輸及儲存條件 元件和物料的運輸及儲存條件 1 相對濕度 RH 15 % ~ 70% 溫度 5176。 C ~ +40176。 C ~ 30176。 濕度敏感元件須使用 MBB(防潮袋 )包裝 。 Air flow 防護(hù)塑膠包裝 (真空與否均可 ， 但須密閉 )。