中國(guó)有源相控陣技術(shù)發(fā)展?fàn)顩r及其戰(zhàn)略影響-展示頁(yè)
2025-07-07 22:02本頁(yè)面
【正文】 being molten pools of Gallium Arsenide reliability of GaAs MMIC chips improves the cooler they are run. Traditional air cooling used in most established avionic hardware is ill suited to the high packaging density of an AESA, as a result of which modern AESAs are liquid designs employ a polyalphaolefin (PAO) coolant similar to a synthetic hydraulic fluid. A typical liquid cooling system will use pumps to drive the coolant through channels in the antenna, and then route it to a heat exchanger. That might be an air cooled core (radiator style) or an immersed heat exchanger in a fuel tank with a second liquid cooling loop to dump heat from the fuel tank. In parison with a conventional air cooled fighter radar, the AESA will be more reliable but will require more electrical power and more cooling, and typically can produce much higher transmit power if needed for greater target detection range performance (increasing transmitted power has the drawback of increasing the footprint over which a hostile ESM or RWR can detect the radar” – Kopp, 2014“由于微波發(fā)射放大器的特性，T/R組件中發(fā)射部分的用電效率典型值小于45%。少數(shù)先進(jìn)AESA系統(tǒng)，例如：ZhukAE雷達(dá)，使用多聯(lián)裝T/R組件封裝技術(shù)，中國(guó)第一代AESA系統(tǒng)可能也使用了多聯(lián)裝T/R組件設(shè)計(jì)。s first generation of AESAs also utilize a multiT/R channel design.圖2：早期美國(guó)制造的4聯(lián)裝T/R組件。因此，在封裝技術(shù)上的進(jìn)步，將允許工程師們?cè)诠潭ǖ娘w機(jī)鼻錐空間里布置更多的T/R組件。通過(guò)減小單個(gè)T/R組件的體積，封裝技術(shù)決定了再固定的空間內(nèi)可容納的最大T/R組件數(shù)量。機(jī)頭部位的容積是一個(gè)相當(dāng)直觀的約束條件，飛機(jī)鼻錐部位容積越大，雷達(dá)（天線(xiàn)陣面）越大。s thermal management system(s). The volume of the nose is a fairly intuitive constraint, the larger an aircraft’s nose is, the larger the radar can be. For example, the F15C’s nose cone is able to acmodate the much larger 1,500 T/R element APG63V(3) radar vs. the F16C Block 60 with its paratively smaller nose cone and its 1,000 T/R element APG80 AESA. Packaging technology refers to how many individual T/R modules can be installed within the finite space usually acplished by reductions in size of the individual T/R modules. The more technologically advanced a firm’s T/R packaging technology is, the smaller the individual T/R modules will be resulting in an increase density of the layout of T/R modules within the array. Thus, advancements in packaging technology enable engineers to acmodate more T/R modules within the fixed volume of the aircraft39。本文主要關(guān)注AESA技術(shù)，但該技術(shù)的更詳細(xì)描述可參考Karlo Kopp的《有源相控陣列——一個(gè)成熟的技術(shù)》一文。此外，當(dāng)前《國(guó)外隱身戰(zhàn)機(jī)威脅分析第一部分：成飛J20》中已經(jīng)對(duì)J20的航電系統(tǒng)的發(fā)展?fàn)顟B(tài)進(jìn)行了大量描述，本文隨后將提供有關(guān)J20有源相控陣?yán)走_(dá)發(fā)展的最新信息。一些基礎(chǔ)信息，例如裝備特定戰(zhàn)斗機(jī)的雷達(dá)系統(tǒng)的名稱(chēng)或型號(hào)與其生產(chǎn)廠商有關(guān)；中國(guó)國(guó)產(chǎn)雷達(dá)的性能參數(shù)很難被證實(shí)。s intent was to pile a wide variety of information on expected future developments in Chinese actively scanned electronic array (AESA) radars. Furthermore, the current “Threat Analysis of Foreign Stealth Fighters: Part I Chengdu J20” is largely dated with respect to developments with the J20’s avionics suite and this article subsequently provides more uptodate information on the J20’s AESA.s Note: During the research process on the J31’s avionics (for the uping Threat Analysis of Foreign Stealth Fighters:J31 Part II), it became apparent that very few credible, verifiable, and nonspeculative English based source materials existed on the subject of PLA fighter radars. Basic information, such the proper name or designation of a radar system is utilized by a particular fighter often varies between sources。美國(guó)在AESA技術(shù)上的領(lǐng)導(dǎo)地位，完全得益于冷戰(zhàn)后期的巨額投資。位于埃爾門(mén)多的美國(guó)F15C單位夫于2000年最先接收該新型雷達(dá)。圖1：裝備F15C的APG63(
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