【正文】 ERANCEOUTLINE177。BOARD： 120㎜ 120㎜。OFMIN.PUNCHINGTOOLSPEC.： （ 1μinch）～ （ 20μinch） 。inch）。NORMAL鍍金厚度： :０．０２５ μｍ（１ μinch）～０．０７５ μｍ（３ μAIROF噴錫厚度：１．３ μｍ～５０ μｍ 。SOLDEROF可剝膠膜厚度：０．２㎜～０．３５㎜ 。PLATINGPRINTINGGREEN。COLOR： BLACK、 WHITE、 BLUEWIDTH： ㎜。字體寬度Ｍｉｎ：０．２㎜ 。㎜ .GROUNDINANDSOLDERRINGOFMINIMUM︰Ｍｉｎ０．５㎜GroundA︰ S/M圈GAPOFCONDUCTORS銅箔厚度THE防焊隔線導(dǎo)體間距GAPWIDTH３５ μm Ｍｉｎ?。埃博L７０ μm Ｍｉｎ　０．３㎜COPPER隔線最小寬度Min.THICKNESSBETWEENLINESOLDER㎜防焊印刷準確度： 177。MinRESIST３５　 μｍ Ｍｉｎ RESISTIR防焊IRCOPPERUV防焊UVTHICKNESSCONDUCTOR（㎜）CLEARANCE防焊圈大於 PAD之最小距離（㎜）SOLDERS/MＭａｘ：０．１３㎜（．００５ “）REGISTRATION BETWEEN BOTH SIDE： Max ㎜（ .005“ ）W≦ 20%A、 W≦ ㎜VARIANCE OF LINE WIDTH線路缺口 ︰ L＜ 2ATHEWIDTHOFTHEW≦ 20%D、 W≦ ㎜VARIANCE ︰ L＜ 2AHOLE正面銅 PAD︰ Ｍｉｎ?。埃玻癌L背面銅 PAD︰ Ｍｉｎ?。埃常癌L LDA wLAwNC０．３５㎜CEM CEM3︰ minPHENOLIC︰ min熱沖板︰Ｍｉｎ 格SPECIFICATIONＭｉｎ?。埃常癌L (沖床 )NORMAL式DESIGN規(guī) 計 ANNULARSOLDERRESIST３５ μｍ Ｍｉｎ?。埃常啊?㎜ Ｍｉｎ?。埃常怠?㎜７０ μｍ Ｍｉｎ　０．４５　 ㎜ Ｍｉｎ?。埃矗怠?㎜某公司關(guān)于單面板的技術(shù)參數(shù)COPPERUV防焊油墨UVTHICKNESSSOLDER㎜ GROUND設(shè)計距線路THE DISTANCE OF　 GROUND WITH CONDUCTOR TraceGroundx銅導(dǎo)體最大面積ＵＬ規(guī)定Ｍａｘ：２０㎜MAX. UNPIERCED AREA： 20㎜ 線路印刷尺寸精度： 177。TO銅箔導(dǎo)體距沖孔邊Ｍｉｎ：０．３㎜Min.TO銅箔導(dǎo)體距板邊Ｍｉｎ：０．３㎜Min.LINE： ㎜LINE１、線路印刷alternativemoreHASL No Best 1 No NoOSP Yes Good 1 No NoElectroless Nickel / Immersion GoldYes Good 2 Yes YesElectroless Palladlum Yes Good 3 ? DifficultComparisonwirewireabilityCost Fabcopperon(directfabricationinprocess?Lowall(鈀 )?Compatiblepatibilitywithplanarity?SomewithNi.?Goodinchesofonsoftmicroinchesplating/Gold:?Selective/excitations500hours?Limitedlifeshortpatibility?CostwithHASL?SomealternativecopperpassivationEntek–ProtectHASLAlternativesSolderHotSolderableDevelopThermalSolderDryCleaningScreencopperElectroplatedlayers:BaseofCoppertheisExposed.(NoteexternalandStrippedresistplateTheetchant.18).TinfromPlatedprotectingaactsplatedwhileetchingthroughisexposedetchtinbyremains,ThecoppertheResistthestripprocesses:manufacturingaetchaswillcopper.oftheelectroplatedtinlayer(0003”)plating,after:rates.15).Tincontrolbathstheintroducedaresurfaces.OrganicthedepositedtheAnodesconsumedtodrivesDCfromballs.copperbathansuspendedThePanelstheholesinsurfaceOnisfilm.theoutlinedfoilThattheelectrodepositedPlatingCoppertakepatternplatingforacreateThedissolveddryfilmofunexposed:created.DryfilmexternalandUVexposedartworkandThepanelcovertheareasthenotethecircuitrytheimagenegativecreateispositive:filmthebothsideslaminatedfilmphotosensitiveinneraslamination:ImagingDrysurfaces.13).Outerwallsdrilledincludespanel,ofentireoverpurecoating,verydepositsThesurfacesexposedbetweenelectricalandholeatdielectricsurfacemetallizeintendedmetalizationCopperAplasmachemicalremovedmust.innertoelectricalwillsmeared.internalsmearresintheremoveddrillbetweentheandtothedrillingholes.Frictionfromanytowaterhighbrushesusingmechanicallyburr.holearoundridgesmallcopperdrilltodrillforthesizes,ofthewhichCAMreceivecontrolledfromreceivecontrolledarethethelayerstheconnectionscreatedrilledwillvacuumfromdrillingPanelsHydraulicusingarebuild.typeonfoils,andwithstackedcoresInnerlayermultilayerformtogetherbondingprocessisPressmultilayerinmaterialsandthestrengththewilltopography.thetocopperoxideontoofatoisOxideThiscustomershortsinnerorlayersweldherebetolerances.Repairslinewidthout’s,testofprocessdetectionofbenefitsfile.graphicscannedversusthemachine.generateddatausesAOItransfertheoccurredmaydefectanysystemtoopticalputeruseofwithareInspection(AOI