bga焊接品質(zhì)分析改善-文庫吧資料
2025-05-13 18:03本頁面
【正文】 ,889 494434 Actual 398,745 275,382 253,807 334,956 215,353 342,602 636,432 306,482 405,023 427,657 338,869 491537 2022年度各月生產(chǎn)計劃與實際達成狀況比較 Q4 TOTAL OUTPUT: 1,258,063PCS 北橋 : $ 南僑 :16$ LANCHIP: 10$ 原不良率以 2022PPM計算 : 1258063**(10$+16$+$)=106935$ DOE Remended Profile Key Data Points ? Liquidus dwell 60s (preferably ~ 30 s) ? Prespike dwell ~ 90 s ? Heating ramp ~ 24 C/sec ? Cooling ramp ~ 35 C/sec ? Bandwidth 10 C (Delta between profile curves) ? O2 Environment 20 ppm 050100150200250030 60 90120150180210240270300330360390DOE Remended Profile Room Temp = 25 C Flux Activation Temp = 150 C Solder Reflow Temp = 183 C Spike Temp ~ 220 C Min =/ min ~ 30 60 sec ~ 90 120 sec DOE Remended Profile Profile Changes ? Belt Speed: Slow to ~ 55 cm/min ? Increase Initial ramp ? Flatten soak ramp ? Lower zone 6 (board should be below 183 C) ? Increase spike temp. ? Increase cooling temp. speed Primary Side Temp. Preheat 03 Preheat 02 Preheat 01 Waves 5565* 95105* 105115* Dwell:
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