qfn封裝工藝(參考版)
2024-08-03 13:01本頁面
【正文】 Place miniBGA Standard Cycle Time : 5 days miniBGA封裝流程 Molding pound Gold wire Epoxy (Silver paste) Gold Sn Epoxy pound Leadframe Copper/Alloy IC封裝材料 Substrate Solder balls BT Resin Solder Alloy Chip Substrate Chip Substrate Chip Substrate Underfill Encapsulant (a) System without underfill (b) System underfill (c) System encapsulated Solder flip chip interconnect systems 晶片 錫球 PCB載板 Silicon Chip Filled Epoxy Encapsulant FR4 Carrier Solder flip chip interconnect systems ? Conventional – Leadframe Type (PDIP, SOP, TSOP, QFP) 傳統(tǒng)封裝（導綫架型） ? Advanced – Substrate Type (BGA) 高級 基片型封裝 Molding pound膠體 Leadframe 導綫架 Gold wire 金綫 Die晶片 Epoxy (Silver paste) 環(huán)氧樹脂（銀膠） Die attach pad 貼 Die 墊 Molding pound模壓膠體 Epoxy (Silver paste)銀膠 Die晶片 Gold wire金綫 Solder ball錫球 BT resin 樹脂基片 Through hole貫穿孔 Die晶片 Gold wire金綫 LOC tape LOC膠帶 ? Leadframe with Downset導綫架下置 ? LOC (Leadonchip)導綫架上置 Package Type
環(huán)評公示相關推薦
鄂ICP備17016276號-1