【導(dǎo)讀】[摘要]本設(shè)計(jì)使用51單片機(jī)對(duì)DDS芯片進(jìn)行控制，利用DDS造波的方法產(chǎn)生需要的正弦信號(hào).用戶可以根據(jù)。需要對(duì)芯片設(shè)定一個(gè)頻率值或相位值,通過(guò)單片機(jī)傳輸芯片控制字對(duì)芯片輸出的頻率和相位進(jìn)行調(diào)節(jié),達(dá)到用戶所要。本設(shè)計(jì)采用模塊化設(shè)計(jì)的方法，不同的模塊為實(shí)現(xiàn)不同的功能而設(shè)計(jì)，總體由單片機(jī)控制協(xié)調(diào)工作。51系列單片機(jī)應(yīng)用廣泛，價(jià)格低廉，比較容易購(gòu)買(mǎi)，DDS芯片價(jià)格較單片機(jī)稍高，但與價(jià)格成百上千的成品信號(hào)發(fā)生器相比，本設(shè)計(jì)經(jīng)濟(jì)優(yōu)勢(shì)顯著。。利用單片機(jī)進(jìn)行數(shù)字化控制，外圍元件較少，僅需輔以少量的阻容元件用于電流電壓匹配控制以及濾波電路既可。數(shù)字化控制的最大優(yōu)點(diǎn)即控制準(zhǔn)確。本設(shè)計(jì)選用的DDS芯片內(nèi)置32位高速數(shù)模轉(zhuǎn)換器，分辨。人或集體，均已在文中作了明確的說(shuō)明并表示了謝意。以明確方式標(biāo)明。本人完全意識(shí)到本聲明的法律后果由本人承擔(dān)。向國(guó)家有關(guān)部門(mén)或機(jī)構(gòu)送交論文的復(fù)印件和電子版，允許論文被查閱和借閱。涉密論文按學(xué)校規(guī)定處理。

　　

【正文】 eration[J].IEEE Signal Processing， 20xx， 9(21):110一 112 [6]求是科技 .單片機(jī)典型外圍器件及應(yīng)用實(shí)例 [M].北京 :人民郵電出版社 ,20xx. [7]高衛(wèi)東 .AD9850 DDS 芯片信號(hào)源的研制 [J].實(shí)驗(yàn)室研究與探索 ,20xx(5):4348. [8]石雄 .DDS 芯片 AD9850 的工作原理及其與單片機(jī)的 接口 [J].國(guó)外電子元器件 ,20xx(5):3335. 陜西理工學(xué)院畢業(yè)設(shè)計(jì) 第 29 頁(yè) 共 69 頁(yè) 附錄 附錄 A：文獻(xiàn)原文 Philips Semiconductors Product specification LM124/224/324/324A/ Low power quad op amps SA534/LM2902 ORDERING INFORMATION DESCRIPTION TEMPER A TU RE RANGE ORDER CODE DWG 14Pin Plastic Dual InLine Package (DIP) 55?C to +125?C LM124N SOT271 14Pin Ceramic Dual InLine Package (CERDIP) 55?C to +125?C LM124F 0581B 14Pin Plastic Dual InLine Package (DIP) 25?C to +85?C LM224N SOT271 14Pin Ceramic Dual InLine Package (CERDIP) 25?C to +85?C LM224F 0581B 14Pin Plastic Small Outline (SO) Package 25?C to +85?C LM224D SOT1081 14Pin Plastic Dual InLine Package (DIP) 0?C to +70?C LM324N SOT271 14Pin Ceramic Dual InLine Package (CERDIP) 0?C to +70?C LM324F 0581B 14Pin Plastic Small Outline (SO) Package 0?C to +70?C LM324D SOT1081 14Pin Plastic Dual InLine Package (DIP) 0?C to +70?C LM324AN SOT271 14Pin Plastic Small Outline (SO) Package 0?C to +70?C LM324AD SOT1081 14Pin Plastic Dual InLine Package (DIP) 40?C to +85?C SA534N SOT271 14Pin Ceramic Dual InLine Package (CERDIP) 40?C to +85?C SA534F 0581B 14Pin Plastic Small Outline (SO) Package 40?C to +85?C SA534D SOT1081 14Pin Plastic Small Outline (SO) Package 40?C to +125?C LM2902D SOT1081 14Pin Plastic Dual InLine Package (DIP) 40?C to +125?C LM2902N SOT271 陜西理工學(xué)院畢業(yè)設(shè)計(jì) 第 30 頁(yè) 共 69 頁(yè) Philips Semiconductors Product specification LM124/224/324/324A/ Low power quad op amps SA534/LM2902 ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER RATIN G UNIT VCC Supply voltage 32 or ?16 VDC VIN Differential input voltage 32 VDC VIN Input voltage to +32 VDC PD Maximum pow er dissipation, TA=25?C (stillair)1 N package 1420 mW F package 1190 mW D package 1040 mW Output shortcircuit to GND one amplifier2 Continuous VCC15VDC and TA=25?C I Input current (V )3 50 mA IN IN TA Operating ambient temperature range LM324/A 0 to +70 ?C LM224 25 to +85 ?C SA534 40 to +85 ?C LM2902 40 to +125 ?C LM124 55 to +125 ?C TSTG Storage temperature range 65 to +150 ?C TSOLD Lead soldering temperature (10sec max) 300 ?C NOTES: 1. Derate above 25?C at the follow ing rates: F package at ?C N package at ?C D package at ?C 2. Shortcircuits f rom the output to VCC+ can cause excessiv e heating and ev entual destruction. The maximum output current is approximately 40mA, independent of the magnitude of VCC. At values of supply voltage in excess of +15VDC continuous shortcircuits can exceed the power dissipation ratings and cause eventual destruction. 3. This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collectorbase junction of the input PNP transistors being forward biased and thereby acting as input bias clamps. In addition, there is also lateral NPN parasitic transistor action on the IC chip. This action can cause the output voltages of the op amps to go to the V+ rail (or to ground for a large overdrive) during the time that the input is driven negative. 陜西理工學(xué)院畢業(yè)設(shè)計(jì) 第 31 頁(yè) 共 69 頁(yè) Philips Semiconductors Product specification LM124/224/324/324A/ Low power quad op amps SA534/LM2902 DC ELECTRICAL CHARACTERISTICS VCC=5V, TA=25?C unless otherw ise specified. SYMBOL PARAMETER TEST CONDITIONS LM124/LM224 LM324/SA534/LM2902 UNIT Min Typ Max Min Typ Max V Offset voltage1 RS=0? ?2 ?5 ?2 ?7 mV OS RS=0?, ov er temp. ?7 ?9 ?VOS/?T Temperature drift RS=0?, over temp. 7 7 ?V/?C I Input current2 IIN(+) or IIN() 45 150 45 250 nA BIAS IIN(+) or IIN(), ov er temp. 40 300 40 500 ?IBIAS/?T Temperature drift Over temp. 50 50 pA/?C IOS Offset current IIN(+)IIN() ?3 ?30 ?5 ?50 nA IIN(+)IIN(), over temp. ?100 ?150 ?IOS/?T Temperature drift Over temp. 10 10 pA/?C VCM Commonmode voltage VCC≤30V 0 0 V range3 VCC≤30V, over temp. 0 VCC2 0 VCC2 CMRR Commonmode rejection VCC=30V 70 85 65 70 dB ratio VOUT Output voltage sw ing RL=2k?, VCC=30V, 26 26 V over temp. VOH Output voltage high RL≤10 k?, VCC=30V , 27 28 27 28 V over temp. VOL Output voltage low RL≤10k?, 5 20 5 20 mV over temp. RL=∞ , VCC=30V, 3 3 over temp. ICC Supply current mA RL=∞ , over temp. VCC=15V (f or large VO 50 100 25 100 swing), RL≥ 2k? AVOL Largesignal voltage gain VCC=15V (f or large VO V/mV swi ng), RL≥ 2k?, 25 15 over temp. Amplifiertoamplifier f=1kHz to 20kHz, 120 120 dB coupling5 input referred PSRR Pow er supply rejection ratio RS≤0? 65 100 65 100 dB Output current VIN+=+ 1V, VIN=0V, 20 40 20 40 source VCC=15V VIN+=+ 1V, VIN=0V, 10 20 10 20 VCC=15V, over temp. mA IOUT Output current VIN=+1 V, VIN+=0V, 10 20 10 20 VCC=15V sink VIN=+1 V, VIN+=0V, 5 8 5 8 VCC=15V, over temp. VIN=+1 V, VIN+