hdi印刷線路板流程介紹-資料下載頁
2024-12-29 07:51本頁面
【正文】 C = One Level Laser Blind Via (雷射 盲孔 ) LASER BLIND BURIED VIA LAYUP BURIED VIA AND LASER BLIND VIA OPTION (雷射 盲埋孔之選擇 ) D C C D = Two Level Laser Via (雷射 盲孔 ) C D C BSTAGE FR4 Core RCC FR4 Core BSTAGE RCC A B B A HDI 印 刷 電 路 板 流 程 介 紹 46 BURIED VIA LAYUP A = THROUGH VIA HOLE (導(dǎo)通孔 ) B = BURIED VIA HOLE (埋孔 ) C = BLIND VIA HOLE (盲孔 ) D = BLIND HOLE MLB VIA (多層盲孔 ) BLIND VIA LAYUP BLIND VIA SEQUENTIAL LAYUP A B B A RESIN BSTAGE BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 ) D A C C E = VIA IN PAD (VIP) (導(dǎo)通孔在 pad裡面 ) E HDI 印 刷 電 路 板 流 程 介 紹 47 Conventional PCB FR4 Buildup Layer Buildup Layer Photovia PhotoImageable Dielectric (PID) FR4 Conventional PTH Conventional PTH HDI 印 刷 電 路 板 流 程 介 紹 48 Conventional PCB Blind Via PCB PTH 3 mil line SVH IVH ChiponSVH FR4 Conventional PTH Conventional PTH HDI 印 刷 電 路 板 流 程 介 紹 50 謝謝觀看 /歡迎下載 BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES. BY FAITH I BY FAITH
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