pcb板制作工藝流程介紹(編輯修改稿)
2025-03-30 16:46 本頁面
【文章內(nèi)容簡介】 26. 雷射鑽孔 (Laser Ablation)及機械鑽孔 Mechanical Drill (.) Laser Microvia (Blind Via) 27. 機械鑽孔 (Mechanical Drill) 28. 電鍍 (Desmear Copper Deposition) 29. 外層線路製作 (Pattern imaging) 壓膜 (D/F Lamination) 曝光 (Exposure) 顯像 (D/F Developing) 蝕銅 (Etching) 去膜 (D/F Stripping) 30. 防焊 (綠漆 )製作 (Solder Mask) WWEI 94V0 R105 31. S/M 顯像 (S/M Developing) 32. 印文字 (Legend Printing) 33. 浸金 (噴錫 ……) 製作 (Electroless Ni/Au , HAL……) WWEI 94V0 R105 WWEI 94V0 R105 Dedicate or universal Tester Flying Probe Tester 34. 成型 (Profile) 35. 測試 (Electrical Testing) WWEI 94V0 R105 WWEI 94V0 R105 36. 終檢 (Final Inspection) 37. . (entek plus Cu_106A….) →Option LASER BLIND BURIED VIA LAYUP A = THROUGH VIA HOLE (導(dǎo)通孔 ) B = BURIED VIA HOLE (埋孔 ) C = One Level Laser Blind Via (雷射 盲孔 ) LASER BLIND BURIED VIA LAYUP BURIED VIA AND LASER BLIND VIA OPTION (雷射 盲埋孔之選擇 ) D C C D = Two Level Laser Via (雷射 盲孔 ) C D C BSTAGE FR4 Core RCC FR4 Core BSTAGE RCC A B B A BURIED VIA LAYUP A = THROUGH VIA HOLE (導(dǎo)通孔 ) B = BURIED VIA HOLE (埋孔 ) C =
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