ic工藝技術(shù)13-集成電路可靠性(ppt79頁)(編輯修改稿)
2025-03-11 18:28 本頁面
【文章內(nèi)容簡介】 鈍化層開裂、硅鋁接觸開路、芯片開裂 高壓蒸煮（ PCT/Autoclave） ? 條件： 121oC/100%RH， 205kPa（ 2atm），168hrs ? 目的： 檢驗(yàn)器件抵抗水汽侵入及腐蝕的能力。 ? 失效機(jī)理： 濕氣通過塑封體及各界面被吸入并到達(dá)芯片表面 ,在鍵合區(qū)形成原電池而加速鋁的腐蝕。另外，水汽帶入的雜質(zhì)在器件表面形成漏電通道。 高溫高濕電加速（ THB/HAST） ? 條件： THB 85oC/85%RH， Vccmax static bias， 1000hrs HAST 130oC/85%RH/2atm， Vccmax bias， 100hrs （ 24hrs HAST≈1000hrs THB ） ? 目的： 模擬非密封器件在高溫高濕環(huán)境下工作，檢驗(yàn)塑封產(chǎn)品抗水汽侵入并腐蝕的能力 ? 失效機(jī)理： 相對(duì)高壓蒸煮，偏置電壓在潮濕的芯片表面加速了鋁線及鍵合區(qū)的電化學(xué)腐蝕。同時(shí)，水汽或塑封體內(nèi)的雜質(zhì)在電應(yīng)力作用下富集在鍵合區(qū)和塑封體內(nèi)引腳之間而形成漏電通道。 常用可靠性試驗(yàn)匯總表 (1) Test Test condition Simulated environment Applicable standards Lowtemperature operating life 低溫工作壽命 10℃/Vcc max/max frequency/min 1,000 device hr/outputs loaded to draw rated current field operation in subzero environment JEDECSTD22 TMA 106 Hightemperature operating life 高溫工作壽命 +125℃ or 150℃/Vcc max/max frequency/min 1,000 device hr/outputs loaded to draw rated current field operation in normal environment MIL – STD883 method 1005 Temperature cycling 溫度循環(huán) 500 cycles, 65℃ to +150℃ at a ramp rate of 25℃/min and with 20 min dwell at each temperature extreme daynight, seasonal, and other changes in environment temperature MILSTD883 method 1010C 常用可靠性試驗(yàn)匯總表 (2) Test Test condition Simulated environment Applicable standards Temperature cycling, humidity, and bias 60 cycles, Vcc ON/OFF at 5min interval, 95%RH, +30 to +65℃ with heating and cooling time of 4hr each and a dwell of 8hr at each temperature extreme slow changes in environment conditions while device is operating JEDEC – STD22 TMA 104 Power and temperature cycling 功率和溫度循環(huán) only on devices experiencing rise in junction temperature greater than 20℃。 min 1,000 cycles of – 40 to +125℃ changes in environment temperature while device is operating JEDEC – STD22 TMA 106 常用可靠性試驗(yàn)匯總表 (3) Test Test condition Simulated environment Applicable standards Thermal shock 熱沖擊 500 cycles of – 55 to +125℃ rapid change in field or handling environment MILSTD883 method 1011B High temperature storage 高溫存儲(chǔ) 150℃, for 1,000hr min storage MILSTD883 method 1008 Temperature humidity bias Vcc max/85℃/85%RH/1,000hr min operation in highhumidity environment JEDEC – STD22 TMA 108 Highly accelerated stress test Vcc max/130℃/85%RH/240hr min operation in highhumidity environment JEDEC – STD22 TMA 110 常用可靠性試驗(yàn)匯總表 (4) Test Test condition Simulated environment Applicable standards Pressure cooker (autoclave) 121C 2atm 96 to 240 hr JEDEC A102B Moisture resistance 10 cycle 25 to 65C RH=90 TO 98% MIL STD 883 1004 Salt atmosphere 鹽霧試驗(yàn) 10 to 50 gr of NaCl /metres 2 35C MIL STD 883 1009 常用可靠性試驗(yàn)匯總表 (5) Test Test condition Simulated environment Applicable standards Mechanical shock 5 shock pulses of glevel and durati
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