倒裝焊與芯片級封裝技術(shù)的研究(編輯修改稿)
2025-01-18 22:40 本頁面
【文章內(nèi)容簡介】 i s w i r e b o n d e d d i e d i r e c t l y t o s u b s t r a t e s u c h a s t h o s e u s e d i n w a t c h e s , s m a r t c a r d sD C A i s d i r e c t c h i p a t t a c h t o s u b s t r a t e s v i a o t h e r m e t h o d s , s u c h a s c o n d u c t i v e a d h e s i v e , m i c r o s p r i n g ( Fo r m Fa c t o r ) 。 w e l d i n gT A B i s t a b o n b o a r d ( n o t i n a p a c k a g e )T o t a l B a r e C h i p ( D i e ) Source: Dataquest, April 2023 Forecast on Bumped Wafers Usage 凸點(diǎn)晶片使用預(yù)測 (20232023) 20 No. of Bumped Wafers 2023 2023 2023 2023 2023 2023 Year Source: Dataquest, April 2023 (Units in Million) Technology Leaders are Sold on Flip Chip 倒裝焊在技術(shù)領(lǐng)先企業(yè)中的應(yīng)用 ? Intel has migrated pletely to flip chip bonded BGA for the Pentium 4 product family due to high clock speed and high pincount (4000)
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