倒裝焊與芯片級封裝技術(shù)的研究-全文預(yù)覽
【正文】 (500MHz). 對于高速芯片，具有良好的電學(xué)性能。 ? The Flipchip bonded wafer is expected to increase from million (2023) to million (2023) wafers. 倒裝焊晶片預(yù)計由三百四十萬片 (2023年 )增長至二千六百二十萬片 (2023年 )。 ? IBM has used flipchip 30 years. 倒裝焊技術(shù)已在 IBM使用了超過 30年 Low Risk and Established Infrastructure 低風(fēng)險和建廠基礎(chǔ) ? Well established industrial infrastructure. 良好的建廠工業(yè)基礎(chǔ) ? Production equipment similar to chip and printer circuit board industries. 生產(chǎn)設(shè)備與芯片和印刷電路板工業(yè)相近 ? Compatible to Surface Mount Technology (SMT). 與表面貼裝技術(shù)兼容 ? Produce smaller and lighter electronic module than wirebonded chips. 生產(chǎn)的電子模塊比絲鍵合小且輕 Flip Chip and Wafer Level Packaging Technology in HKUST 香港科技大學(xué)倒裝焊與晶片級封裝技術(shù)的研究 ? Electroplating solder bumping (Mainstream Flip Chip Technology) 電鍍凸點(diǎn)工藝 (主流倒裝焊凸點(diǎn)技術(shù) ) ? Electroless UBM and stencil printing bumping (Lower cost Flip Chip Technology w/o photolithography and vacuum processing) 化學(xué)鍍凸點(diǎn)下金
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