倒裝焊與芯片級封裝技術的研究-全文預覽
【正文】 (500MHz). 對于高速芯片，具有良好的電學性能。 ? The Flipchip bonded wafer is expected to increase from million (2023) to million (2023) wafers. 倒裝焊晶片預計由三百四十萬片 (2023年 )增長至二千六百二十萬片 (2023年 )。 ? IBM has used flipchip 30 years. 倒裝焊技術已在 IBM使用了超過 30年 Low Risk and Established Infrastructure 低風險和建廠基礎 ? Well established industrial infrastructure. 良好的建廠工業(yè)基礎 ? Production equipment similar to chip and printer circuit board industries. 生產(chǎn)設備與芯片和印刷電路板工業(yè)相近 ? Compatible to Surface Mount Technology (SMT). 與表面貼裝技術兼容 ? Produce smaller and lighter electronic module than wirebonded chips. 生產(chǎn)的電子模塊比絲鍵合小且輕 Flip Chip and Wafer Level Packaging Technology in HKUST 香港科技大學倒裝焊與晶片級封裝技術的研究 ? Electroplating solder bumping (Mainstream Flip Chip Technology) 電鍍凸點工藝 (主流倒裝焊凸點技術 ) ? Electroless UBM and stencil printing bumping (Lower cost Flip Chip Technology w/o photolithography and vacuum processing) 化學鍍凸點下金
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