【文章內容簡介】 nal類比電路/類比訊號.Anchoring Spurs著力爪.Angle ofContack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環(huán).Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.AntiFoaming Agent消泡劑.Antipit Agent抗凹劑.AOI自動光學檢驗.Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準.Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.Astage A階段.ATE自動電測設備.Attenuation訊號衰減.Autoclave壓力鍋.Axiallead軸心引腳.Azeotrope共沸混合液. *****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角.Backpanels, Backplanes支撐板.Backup 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝).Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則Be=145(145247。)凡液體比重比水輕則Be=140247。()* 為比重即同體勣物質對純水1g/cm的比值).Beam lead光芒式的平行密集引腳.BedofNail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.BiLevel Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖 .Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進行熔接的方式).Break Point顯像點.Breakaway Panel可斷開板.Breakdown Voltage崩潰電壓.Breakout破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.BstageB階段.Build Up Process增層法制程.Buildup堆積.Bulge鼓起.Bump 突塊.Bumping Process凸塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burnin高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar匯電桿.Butter Coat 外表樹脂層.*****C*****C4 Chip JointC4晶片焊接.Cable電纜.CAD電腦輔助設計.Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法.Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細作用.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理.Card卡板.Card Cages/Card Racks電路板搆裝箱.Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型勣體電路器.Catalyzed Board, Catalyzed Substrate催化板材.Catalyzing催化.Cathode陰極.Cation陰向離子, 陽離子.Caul Plate隔板.Cavitation空泡化半真空.CentertoCenter Spacing中心間距.Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨.Chemical Resistance抗化性.Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG).Chisel鑽針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑.Circumferential Separation環(huán)狀斷孔.Clad/Cladding披覆.Clean Room無塵室.Cleanliness清潔度.Clearance余地,余環(huán).Clinched Lead Terminal緊箝式引腳.Clinchedwire Through Connection通孔彎線連接法 .Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數.CoFiring共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM1,CEM3)復合板材.Condensation Soldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區(qū).Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠.Controlled Depth Drilling定深鑽孔.Conversion Coating 轉化皮膜.Coplanarity共面性.Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗.Copper Paste銅膏.CopperInvarCopper (CIC)綜合夾心板.Core Material內層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標記.Counterboring方型擴孔.Countersinking錐型擴孔.Coupling Agent 偶合劑.Coupon, Test Coupon板邊試樣.Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積.Crosshatch Testing十字割痕試驗.Crosshatching十字交叉區(qū).Crosslinking, Crosslinkage交聯,架橋.Crossover越交,搭交.Crosstalk雜訊, 串訊.Crystalline Melting Point晶體熔點.CStage C階段.Cure硬化,熟化.Current Density電流密度.CurrentCarrying Capability載流能力.Curtain Coating濂塗法.*****D*****Daisy Chained Design菊瓣設計.Datum Reference基準參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計)).Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像 .Deviation偏差.Device電子元件.Dewetting縮錫.DglassD玻璃.Diaze Film偶氮棕片.Dichromate重鉻 酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown Voltage介質崩潰電壓.Dielectric Constant介質常數.Dielectric Strength介質強度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法.Diffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板.Dish Down碟型下陷.Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受擾焊點.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In / Drag Out帶[進/帶出.Drag Soldering拖焊.Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削面.Drill Pointer鑽針重磨機.Drilled Blank已鑽孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy, Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動態(tài)軟板.*****E*****EBeam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空