0402chiprlc制程與不良品分析流程-版本2(存儲版)
【正文】 壓合Printing Stacking lamination薄帶成型Tape casting AMBIT Microsystems CorporationChip Resistor 構(gòu)造Structure substrate (Al2O3) mm termination (AgPd) 11 ?m termination(AgPd or Ag) 11 ?m layer (RuO2) 11 ?m layer (SiO2) 11 ?m cut layer (epoxy) 25 ?m termination (AgPd or Ag or NiCr) ~ ?m9. Diffusion barrier (Ni) 8 ?m plating(Sn) 8 ?m ? 網(wǎng)印 Resistive layer的厚度及精準度為 25+/4um. AMBIT Microsystems CorporationChip resistor 製造流程RAW MaterialsIQC Primary Electrode Printing DryingResistor Body PrintingInprocess InspectionLaserTrimmingInprocessInspectionOver coating PrintingInprocessInspectionDryingDrying Marking DryingFiringInprocessInspectionDryingFiringInprocessInspection“B” BreakInprocessInspection Electrode NiPlatingSputteringElectrode TinPlatingInprocessInspection TestingPackagingFQCStockInprocess Inspection“A” Break(CB) Backside Electrode printing Drying Secondary Electrode PrintingMagic screenInprocess Inspection FiringFiring?Laser切割是整排先量再切 ,切完後再量其電阻值 . AMBIT Microsystems CorporationChip Capacitor信賴性試驗 AMBIT Microsystems CorporationChip Resistor信賴性試驗 AMBIT Microsystems CorporationTesting substrate:Bending Test AMBIT Microsystems CorporationPCB Pad 設計 (0402 Chip)A = pad to pad 外距長B = pad長C = pad寬D = pad to pad內(nèi)距長b = 開孔 pad長c = 開孔 pad寬d = 開孔 pad to pad內(nèi)距長e = 半圓直徑長 (1/3)*Cf = 半圓直徑長 (1/3)*bADCBdfebc AMBIT Microsystems CorporationModel of Chip R/C Solder Wetting Good Poor Solder Cold Solder DewettingReflow temp.175~183 oC183? oCFinalChip is pushed up Unequal solder wetting balance
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