【正文】 B 封裝及基本概念 ................................................ 11 常見封裝 ........................................................ 11 .(DIP)直插 ....................................................... 11 .(BGA)球柵陣列封裝 ............................................... 11 .(SOP)小外形封裝 ................................................. 12 .(QFP)四側(cè)引腳扁平封裝 ........................................... 12 .(QFN) 方形扁平無引腳封裝 ........................................ 13 .(SOT)小外形晶體管封裝 ........................................... 14 .(SIP)系統(tǒng)級封裝 ................................................. 14 ........................................................ 14 ． (Differengtial Signal)差分信號 ................................. 14 ． (microstrip）微帶線 ............................................ 15 ． (stripline/double stripline）帶狀線 ........................... 15 ． 3W 規(guī)則 ......................................................... 15 ． 20H 規(guī)則 ........................................................ 15 ． (impedance)阻抗 ................................................ 16 ． (Si)信號完整性 ................................................. 16 ．（ EMI）電磁干擾 ................................................. 16 ． (Analog Data）模擬數(shù)據(jù) ......................................... 16 ． (Digital Data)數(shù)字數(shù)據(jù) ....................................... 16 ． (DRC)設計規(guī)則檢測 ............................................. 17 ． (DFA)裝配設計 ................................................. 17 ． (TP)測試點 .................................................... 18 ． Gerber 文件 .................................................... 18 第四章：層疊設計與阻抗控制 ................................................ 19 北華航天工業(yè)學院畢業(yè)論文 3 層的構成 ........................................................ 19 PCB 層數(shù)選擇 .................................................. 19 .................................................. 19 第五章： PCB 布線基本原則 .................................................. 20 ............................................................ 20 .................................................. 20 ............................................ 20 EMC 等其他干擾的控制要求： .............................. 20 .................................................. 21 .......................................... 21 ...................................................... 21 ........................................................ 21 第六章：常見 PCB 電路設計 .................................................. 22 ............................................................ 22 ............................................................ 22 ： .......................................................... 23 ............................................................ 23 光口電路 ............................................................ 24 （ LDO） ................................................... 24 ........................................................ 24 接口電路 ........................................................ 25 電路 ........................................................... 25 接口電路 ....................................................... 26 第七章： DDR3 的 PCB設計實例 ............................................... 27 概述 ........................................................... 27 ． FLYBY 設計 ..................................................... 27 電源設計 .................................................... 27 （ Burst Length， BL）： ................................... 27 DDR3 新增的重置（ Reset）功能： ................................... 28 新增 ZQ 校準功能： ........................................... 28 走線注意事項 ................................................... 28 ........................................................ 28 ........................................................ 29 ................................................................ 29 7. 4．其他總結(jié) .......................................................... 30 第八章： PCB 制作工藝 ...................................................... 31 PCB 的分類 ........................................................... 31 ． PCB 制作的準備 ..................................................... 34 . 基板 ........................................................... 34 . 銅箔 ........................................................... 35 . PP ............................................................. 35 北華航天工業(yè)學院畢業(yè)論文 4 . 干膜 ........................................................... 35 . 防焊漆 ......................................................... 36 . 底片 ........................................................... 36 ． PCB 流程制作 ....................................................... 36 的層別 ....................................................... 36 板生產(chǎn)步驟 .................................................. 37 第九章：多層板成型段 ...................................................... 41 ...................................................... 41 （黑化） .................................................... 41 (預迭 ) ..................................................... 41 ............................................................ 42 ............................................................ 42 .......................................................... 43 內(nèi)層線路板鉆孔 ..................................................... 43 ...................................................... 44 (PTH) ................................................... 44 ............................................................ 45 ．外層線路板成型 ..................................................... 45 處理 .......................................................... 45 ............................................................ 45 (Exposure) .................................................. 46 (Developing) ............................................... 46 第十章 多層板后續(xù)流程 .............