pcb板制作工藝流程介紹(已修改)
2025-03-20 16:46 本頁面
【正文】 HDI Manufacturing Process Flow Preengineering Pattern imaging Etching Laminating Drilling Cu plating Hole plugging Pattern imaging Lamination Laser Ablation Mechanical drilling Pattern imaging Cu plating Solder Mask Surface Finished Routing Visual inspection Electric test Shipping Preengineering Pattern imaging Etching Laminating Drilling Desmear Cu plating Hole plugging Cu plating Belt Sanding Lamination Laser Ablation Mechanical drilling Cu plating Pattern imaging Solder Mask Gold plating Routing Electrical test Pattern imaging Hole counter Shipping Visual inspection (THIN CORE) Laminate Copper Foil 裁板 (Panel Size) COPPER FOIL Epoxy Glass Photo Resist (壓膜 ) (Dry Film Resist Coat) Etch Photoresist (D/F) Photo Resist 3. 內(nèi)層線路製作 (曝光 )(Expose) A/W Artwork (底片 ) Artwork (底片 ) After Expose Before Expose 4. 內(nèi)層線路製作 (顯影 )(Develop) Photo Resist 5. 內(nèi)層線路製作 (蝕刻 )(Etch) Photo Resist 6. 內(nèi)層線路製作 (去膜 )(Strip Resist) ( Oxide Coating) 8. 疊板 (Layup) LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 1 LAYER 6 Layer 1
教學(xué)課件相關(guān)推薦
鄂ICP備17016276號-1