濺射氣壓對(duì)bmn薄膜晶體形貌和介電性能的影響業(yè)設(shè)計(jì)論文(已修改)
2025-09-05 18:33 本頁(yè)面
【正文】 2020 屆畢業(yè)設(shè)計(jì)（論文） 題 目： 濺射氣壓對(duì) BMN 薄膜晶體形貌和介電性能的影響 專 業(yè)： 班 級(jí)： 姓 名： 指導(dǎo)老師： 起訖日期： 年 月 南京工業(yè)大學(xué)本科生畢業(yè)設(shè)計(jì)（論文） I 濺射氣壓對(duì) BMN 薄膜晶體形貌和介電性能的影響 摘要 本實(shí)驗(yàn)采用磁控濺射法，在不同濺射氣壓下（本實(shí)驗(yàn)所采用的實(shí)驗(yàn)氣壓為 、 、 、 ），于 Si 基片上沉積鈮酸鉍鎂（ ,BMN）薄膜 ,主要研究了不同的濺射氣壓對(duì) BMN 薄膜的結(jié)構(gòu)、表面形貌和介電性能的影響。實(shí)驗(yàn)結(jié)果顯示，制得的 BMN 薄膜具有立方焦綠石結(jié)構(gòu)。在高氣壓下所得到的 BMN薄膜，其晶粒尺寸較低氣壓下所制得的薄膜大。但當(dāng)氣壓到 時(shí)晶粒尺寸變小。薄膜的介電常數(shù)以及介電調(diào)諧率隨著氣壓的增大而增大。薄膜的漏電流隨之氣壓的升高而減小。另外，氣壓的升高對(duì) Bi2O3的揮發(fā)也有很好的抑制作用。 關(guān)鍵詞 ：磁控濺射、鈮酸鉍鎂 (BMN)薄膜、介電調(diào)諧率、漏電流密度 Effects of sputtering pressure on the structre and dielectric properties of thin film Abstrict In is work we prepared BMN() thin films on Si substrate by radio frequence magron sputtering under different pressure.(Test pressure:,).The effects of sputtering pressure on the structure,surface morphology and dielectric properties of BMN thin films were results show that the prepared BMN thin films exhibit cubic pyrochlore , the grain size of the film deposited in high sputtering pressure are bigger than that one which deposited in low sputtering ,while the sputtering pressure reaches to ,the grain size of the BMN thin film bees smaller. The dielectric properties and dielectric tunability of BMN thin films increases with the increaseing of the sputtering leakage current density of this film drops with the increaseing of the sputtering ,the increaseing of sputtering pressure can restrain the volatilization of Bi2O3. 目 錄 II 目 錄 摘要 .................................................................................................................................... I ABSTRICT ....................................................................................................................... I 第一章 緒論 ....................................................................................................................1 BMN 薄膜的研究背景及意義 ......................................................................................1 BMN 薄膜研究現(xiàn)狀 ..................................................................................................3 國(guó)內(nèi)外相關(guān)研究 .................................................................................................3 .........................................................................3 本文研究?jī)?nèi)容 ...........................................................................................................5 第二章 研究方法與實(shí)驗(yàn) .............................................................................................6 BMN 陶瓷靶材的制備 ..............................................................................................6 襯底的預(yù)處理 ............................................................................................................8 BMN 薄膜制造工藝 ..................................................................................................8 電容結(jié)構(gòu) BMN 薄膜樣品的制備 ............................................................................9 MIM 薄膜電容器結(jié)構(gòu) ........................................................................................9 電極的制備 .......................................................................................................10 對(duì)薄膜進(jìn)行表征 .....................................................................................................10 第三章 實(shí)驗(yàn)結(jié) 果與討論 ...........................................................................................12 濺射氣壓對(duì) BMN 薄膜相結(jié)構(gòu)的影響 ..................................................................13 濺射氣壓對(duì) BMN 薄膜表面形貌的影響 ...............................................................13 濺射氣壓對(duì) BMN 薄膜電性能的影響 ...................................................................14 第四章 結(jié)論 ..................................................................................................................17 參考文獻(xiàn) .................................................
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