【正文】 用感光熱固化綠油） → 清洗、干燥 → 網(wǎng)印標(biāo)記字符圖形、固化 → （噴錫或有機(jī)保焊膜） → 外形加工 → 清洗、干燥 → 電氣通斷檢測(cè) → 檢驗(yàn)包裝 → 成品出廠。Basic((Cores基材?FullyfiberglassresinClad?Indentifiedcore,weightPrepregs?Preimpregnatedlayers?PartiallyfiberglassresinbytypeCopper（銅箔）*ElectrodepositedstdDSTF*1Oz=”ConstructionThicknessTolerancesLaminates(”)For example : Elite Material Co.,ltd EM822 SPEC TABLE ThicknessTolerancesLaminates(”)PrepregsFor example : GETEK ML2023 SerialsInnerlayer1).Chemicalthecoating,dirt,grease,theCladFilmofUVdrytocleanedofcopperUtilizesfullysheet(CSL)applierfilmbothsidesofcopperthroughheatpressure.3).DryExposure:negativephotoorisintofilm,bothofcopperUVexposureaindryexposureUVisthefilmunderneathclearAreastheartwork,ittoandThecovereddarkofartworksoft.4).DrydevelopingAfterdryis,unexposedareasthedissolvedwhilehardenedfilmunaffected5).CopperremainingdryoncopperActsaandunprotectedchemicallyorResist:ThedryisfromleavingdesiredpatternReproducedtheThetransferhaspleted.7).PostEtchPunchprocesstoolingwhichusedaligncoressubsequentPEPasystemtargetsincopperlocatepunchholesahighOpticalcoresinspectedtheaaidedinspectionlocatepatternthathaveduringimageprocessTheprocessafileatCAMTheparesimageaputerAOIconsistearlyofdeviations,reductionfinalfallconsistentandcanmadetoinneropensTrimlayerperspecifications.9).InnerlayerprocessdesignedintentionallycreatecoatingcopperthecircuitryenhancesurfaceThisincreasebondbetweencoretheusedthelamination.10).VacuumLaminationLaminationtheofcorestoapanel.oxidizedareupprepregcopperdependingtheofMultilayerslaminatedaPress.11).NCarrivingthepressbetointerbetweendifferentofcircuitrydrillCNCandfilesCNCandfilesfromcentercontainnumberhitsholeandpaththeheadfollow.AsremovesacopperformstheedgeTheisremovedscrubbingandpressureblastremovedebristheduringcausesdrillheatupmeltresincoppertheis,softwillacrossconductorsTheresinpreventconnectionlayersItbebyorattack.12)Electrolesschemicalprocesstotheofmaterialthewallinstituteconnectionallcopper.processathin(2Oz)fragileofcopperthesurfacethethistheholeandexternalLayerfilmJustinlayerdryisonofpanel.DryexposureAimageusedtoa(reverse)ofexternalontodryfilm,thatdarkofartworktheholes.filmthearetolighttheimagedevelopingTheareasthearesway.dryfilmas“channel”coppertoplace.14).CopperisontocopperisbydryCopperplatedtheandtheofpanel.areinacidcopperalongWithanodeCurrentaRectifiercopperbefromandonplatedpoundsalsotoPlatingtodepositionplatingImmediatelycopperaThinofisonSurfacetheTinactanresistInfutureprocess.16).WetDryfilmremovesplatingexposingbaseunderneath.platedCopperprotectedtheplatingresist.17).ThecopperremovedanProcess,thethinasresistthecopperthestrip:tinetchisoffthecircuitrythatremainingconsiststhreecopperElectrolesscopperSoldermask.SurfacePrintTackPISMPhotoimageablemaskExposureCureFinishes1)HASL:AirLeveler2)Commontosolder(OSP.Cu56)?Organicofsurface?Polpulartoissuesfluxeffective?Veryshelf–thermalNickelImmersionNickelGoldprocess?45ofgoldtopofsolderabilityexcellentissuessoldermaskPalladiumwithsolderingsoluabilitysolder?Simpleprocessplateto)PlanaritySolderComplexityAIbondingAubondingofmonfinishesETCHING RESIST PRINTING 銅箔導(dǎo)體寬度Ｍｉｎ：０．１８㎜Min.WIDTH銅箔導(dǎo)體間距Ｍｉｎ：０．２㎜Min.SPACING： ㎜EDGECONDUCTOR： ㎜CLEARANCEHOLES： ㎜０．１０㎜REGISTRATION PRECISION： 177。RESI銅箔厚度 THEOFSOLDERRESISTIR防焊油墨I(xiàn)R最小焊圈MIN.RINGRHOLEPAD (沖床 )設(shè) 方 DESIGN０．４０㎜PAPER㎜冷沖板︰Ｍｉｎ ㎜WITHDRILLING線路突出與線路缺口 OFSPACINGVARIANCELINEANDSPACING 雙面線路印刷正背導(dǎo)準(zhǔn)確度 ２、防焊印刷A︰ S/M圈B︰ PADRRESISTTO銅箔厚度OFSOLDERSOLDER０．１５㎜ Ｍｉｎ?。埃玻癌L７