硅片切割工藝講義ppt課件-展示頁
2025-05-12 18:14本頁面
【正文】 . Cutting rates are relatively slow, approximately 24 in178。硅片切割工藝講義 制造二部 林青云 2022年 3月 主要內(nèi)容 車間流程的介紹 Squarer的介紹 Cropping Saw的介紹 Grinder的介紹 gluing Brick 的介紹 Wire Saw Cleaning Station的介紹 車間流程的介紹 Building 1 Layout SQUARER的介紹 Cropping Saw BAND SAW ?Slice usable length of brick by cropping top amp。 bottom ?Usable length of brick is determined by the Life time tester. ?Special diamond coated blade is used for cropping ?Blade rotates at constant speed. ? Mount the Brick Suitably on the Table ?Table moves at set speed to slice the brick ?Maximum performance will e from proper band alignment, tensioning and band speed. Silicon: ?Product is cut using water as the coolant (Some prefer to condition the water to minimize contamination of the silicon metal). ?Cutting rates are relatively slow, approximately 24 in178。 per minute. Proper grit size selection is important to minimize chipping of the workpiece. Smaller grit size, such as 80/100 mesh, will slow cutting rates but improve surface finish. SPECIFICATIONS 1. Band Specifications: Diamond coated steel blade . Length : 240, Width : 1, Thickness: , Grit : 80/100 2. Cutting Specifications: ? Feed rate: ” to 1” per minute ? Feed pressure: 100 PSI (1Bar=) ? Blade tension: 22022 PSI ? Belt Speed : 3500 ~4000 FPM BRICK PREPARATIO
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